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mems microphone

A microphone and ASIC chip technology, which is applied in the field of MEMS microphones, can solve problems such as short circuit, breakdown open circuit, etc., and achieve the effect of improving reliability, avoiding open circuit or short circuit, and improving dustproof function

Active Publication Date: 2022-04-29
AAC ACOUSTIC TECH (SHENZHEN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a MEMS microphone, which aims to solve the problem of open circuit or short circuit caused by the breakdown of the buried resistance layer in the ASIC chip and the substrate by the electrostatic discharge current

Method used

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Examples

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no. 1 example

[0028] see also Figure 1-2 A MEMS microphone of this embodiment includes a housing 10 with a package cavity 110, and MEMS chips 13 and ASIC chips 14 installed in the package cavity 110. The housing 10 includes a substrate 11 for mounting the MEMS chips 13 and ASIC chips 14, and a housing 12 surrounding the substrate 11 to form the package cavity 110. The microphone also includes a first metal lead 17 electrically connecting the ASIC chip 14 with the substrate 11 and a second metal lead 18 electrically connecting the ASIC chip 14 with the MEMS chip 13. The substrate 11 is provided with an acoustic through hole 111. The microphone also includes a conductive dust-proof net 15 covering one end of the acoustic through hole 111 near the MEMS chip 13, a first grounding pad 112 fixedly connected with the conductive dust-proof net 15, a first grounding pad 116 disposed on the outer surface of the substrate and electrically connected with the grounding terminal of the external circuit, and ...

no. 2 example

[0037] See further. Figure 3-4 Unlike the first embodiment, the conductive dustproof net 15 in this embodiment is fixed inside the substrate 11. Specifically, a second mounting groove 114 is provided between the inner surface and the outer surface of the substrate 11 to accommodate the conductive dust-proof net 15, and the conductive dust-proof net 15 covers the middle position of the acoustic through hole 111.

[0038] The MEMS microphone of this embodiment improves the dustproof function of the microphone by covering the conductive dustproof net 15 on the acoustic through hole 111; The provision of the metal conductor 19 can realize the conduction of the first metal lead, the first grounding pad 112 and the first grounding pad 116 drawn out from the ASIC chip 14. The ASIC chip 14 is electrically connected with the first metal lead 17, which leads the static electricity in the ASIC chip 14 into the ground layer of the external circuit of the terminal device through the first grou...

no. 3 example

[0041] See further. Figure 5-6 Unlike the first embodiment and the second embodiment, the conductive dustproof net 15 is arranged on the surface of the substrate 11 away from the MEMS chip 13. The substrate 11 is provided with a second grounding pad 117 electrically connected with the conductive dustproof net 15 and a metal conductive piece 19 electrically connected with the first metal lead 17 and the second grounding pad 117. The conductive dustproof net 15 is electrically connected with the grounding terminal of the external circuit.

[0042]It should be noted that the outer surface of the substrate 11 is provided with a first mounting groove 113 for accommodating a conductive dustproof net 15, and the conductive dustproof net 15 covers the end of the acoustic through hole 111 facing away from the MEMS chip 13. The conductive dustproof net 15 is arranged on the outer surface of the base plate 11, and the outer surface of the conductive dustproof net 15 is in the same horizontal...

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Abstract

The invention provides a MEMS microphone. The MEMS microphone of the present invention includes a housing with a package cavity and a MEMS chip and an ASIC chip, and the MEMS microphone also includes a conductive dust-proof net covering the acoustic through hole, and a fixed connection with the conductive dust-proof net. The first grounding pad and the first grounding pad arranged on the outer surface of the substrate and electrically connected to the ground terminal of the external circuit are electrically connected to the first metal lead, the first grounding pad, and the first grounding pad at the same time. Connected metal conductors. The first metal lead guides the static electricity in the ASIC chip from the first ground pad or the conductive dust-proof net to the ground layer of the external circuit of the terminal device through the guidance of the metal conductor, and the first ground pad guides the substrate through the guide of the metal conductor. The static electricity in the ground is introduced into the ground layer of the external circuit of the terminal equipment by the first ground pad or the conductive dust-proof net, which can largely prevent the ASIC chip and the embedded resistance layer in the substrate from being broken down by ESD current to cause open circuit or short circuit .

Description

[technical field] [0001] The invention relates to the technical field of electroacoustic conversion, in particular to a MEMS microphone. [background art] [0002] MEMS microphone is an electrical transducer based on MEMS technology, which has the characteristics of small volume, good frequency response and low noise. With the development of miniaturization and thinness of electronic equipment, MEMS microphones are more and more widely used in electronic equipment. [0003] The functions of mobile terminals such as mobile phones and tablets are becoming more and more powerful. As the circuit boards become smaller and more integrated, MEMS microphones in mobile phones are more and more vulnerable to electrostatic damage. ESD(Electro-Static discharge) means "electrostatic discharge". ESD is a discipline formed since the middle of 20th century to study the generation, harm and protection of static electricity. Therefore, it is customary in the world to collectively refer to the equip...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R19/04
CPCH04R19/04H04R2201/003
Inventor 柏杨饶成辉洪亭亭
Owner AAC ACOUSTIC TECH (SHENZHEN) CO LTD