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Adhesive for building decorative panels and preparation method thereof

A technology for building decoration and board glue, applied in the direction of adhesives, adhesive types, epoxy resin adhesives, etc., can solve the problems of easy aging, easy peeling of adhesives, performance degradation, etc. Effect of photooxidation, uniform hydrophobicity

Active Publication Date: 2021-10-29
佛山市同高新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Epoxy resin contains a variety of polar groups and highly active epoxy groups, so it has strong adhesion to metals, glass, cement, wood, plastics and other polar materials, especially materials with high surface activity At the same time, the cohesive strength of the epoxy cured product is also very large, so its bonding strength is very high. At the same time, the epoxy resin has high corrosion resistance and good dielectric properties, and can resist many acids, alkalis, salts, solvents, etc. It is widely used in the construction field for bonding and fixing. However, during the bonding process of building decorative panels, because the decorative panels directly contact the wall, the moisture is relatively high, resulting in the adhesive being easily peeled off in a humid environment for a long time. , At the same time, due to the poor weather resistance of epoxy resin, it is easy to age under the action of higher temperature and strong ultraviolet rays, which will cause its performance to decrease

Method used

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  • Adhesive for building decorative panels and preparation method thereof
  • Adhesive for building decorative panels and preparation method thereof
  • Adhesive for building decorative panels and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] The specific preparation process of silylated epoxy resin is as follows:

[0026] Step 1: Weigh 100g of phenol and add it to 1L of ethanol, then add 132g of acryloyl chloride to it, and add phosphoric acid solution to it to adjust the pH of the solution to 1, heat up to 50-60°C and stir for 8-9h, then cool down to 25- At 30°C, add 68g of anhydrous aluminum chloride to the reactor in 3 times, the same amount each time, keep warm for 3-4h, then add 1mol / L hydrochloric acid solution, stir for 1-1.5h and then let it stand Separate the layers, and wash the oil phase of the upper layer to neutrality, then carry out vacuum distillation to obtain unsaturated phenol;

[0027] Step 2: Add 100g of the unsaturated phenol prepared in step 1 and 500mL of ether into the reaction kettle at the same time, then add 4g of isopropanol-platinum into it, raise the temperature to 90-95°C and stir for 8-9h, then slowly drop into it Add 39g of tetramethyldisiloxane, after the dropwise addition...

Embodiment 2

[0031] The specific preparation process of the silylated epoxy resin is as follows: Weigh 100g of E-44 type epoxy resin, then add 18g of n-propyltrimethoxysilane into it, mix and stir evenly, and obtain the silylated epoxy resin.

Embodiment 3

[0033] The specific preparation process of the weather-resistant curing agent is as follows:

[0034] ① Add tetramethylpiperidinamine and allyl glycidyl ether into the reaction vessel according to the ratio of the amount of substances of 1:1, stir and react at room temperature for 3-4 hours, and then conduct vacuum distillation to obtain product A;

[0035] ②Put 10g of product A and 80mL of acetone into the reaction kettle at the same time, then add 0.2g of isopropanol-platinum into it, raise the temperature to 90-95°C and stir for 8-9h, then slowly add 3.1g of tetramethyldimethoxy Siloxane, after complete dropwise reaction at constant temperature for 24-25h, then vacuum distillation to obtain weather-resistant curing agent.

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Abstract

The invention discloses an adhesive for building decorative boards, which comprises component A and component B, wherein component A and component B are mixed according to a mass ratio of 5.2-5.5:1. The adhesive prepared by the present invention is prepared by curing and cross-linking silanized epoxy resin through a weather-resistant curing agent. Since the silanized epoxy resin is centered on tetramethyldisiloxane, two phenolic hydroxyl groups are connected. The middle part of each chain link in the epoxy resin generated after polymerization contains siloxane bonds, so that the prepared polymer uniformly contains a large number of siloxane bonds, and the weather-resistant curing agent used at the same time is based on tetramethyl Disiloxane is the center, piperidinamine is connected to both sides respectively, and the polymer chain generated after crosslinking and curing evenly contains oxysilane bonds, so that the prepared product has uniform high temperature resistance and hydrophobicity, and then The shear strength of the adhesive remains unchanged at higher temperatures, and the colloid is not easy to peel off in a humid environment.

Description

technical field [0001] The invention belongs to the field of adhesive preparation, and relates to an adhesive for building decorative boards and a preparation method thereof. Background technique [0002] Epoxy resin contains a variety of polar groups and highly active epoxy groups, so it has strong adhesion to metals, glass, cement, wood, plastics and other polar materials, especially materials with high surface activity At the same time, the cohesive strength of the epoxy cured product is also very large, so its bonding strength is very high. At the same time, the epoxy resin has high corrosion resistance and good dielectric properties, and can resist many acids, alkalis, salts, solvents, etc. It is widely used in the construction field for bonding and fixing. However, during the bonding process of building decorative panels, because the decorative panels directly contact the wall, the moisture is relatively high, resulting in the adhesive being easily peeled off in a humi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C08G59/06C08G59/14C08G59/50
CPCC08G59/063C08G59/1438C08G59/506C09J163/00
Inventor 不公告发明人
Owner 佛山市同高新材料有限公司
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