This invention discloses a
semiconductor device and a method for forming the same, wherein the
semiconductor device includes: a
semiconductor substrate; a gate structure located on the semiconductor substrate; a source region and a drain region located in the semiconductor substrate and on opposite sides of the gate structure; a sacrificial
oxide layer located on the semiconductor substrate; a contact etch stop layer located on the sacrificial
oxide layer; a lower interlayer
dielectric layer located on the contact etch stop layer; a high-resistivity
dielectric layer located on the gate structure and the lower interlayer
dielectric layer; and a high-resistivity field plate, wherein the high-resistivity field plate is at least partially located on the high-resistivity
dielectric layer.