Heat dissipation structure of head-mounted intelligent terminal

Abstract

The invention discloses a heat dissipation structure of a head-mounted intelligent terminal. A cold plate is in contact with the top surface of a main chip on a PCB in the product; a micro-channel matched with flowing of cooling liquid is formed in the cold plate, a left adapter and a right adapter which are communicated with the micro-channel are arranged at the left end and the right end of thecold plate respectively, the left adapter and the right adapter are communicated with a micro-pump and a heat dissipation component through hoses respectively, and a heat dissipation structure matchedwith circulating flowing of the cooling liquid in the heat dissipation structure is jointly formed. The cold plate with the micro-channel and the corresponding water cooling structure are adopted; the advantage of lower thermal resistance is utilized; a large amount of heat generated by a main chip during working is transferred to a local cold region which is difficult to realize by adopting a conventional heat dissipation method more quickly and efficiently; the defects of main chip heating, surface shell scalding and the like of the product in a high-performance use scene are effectively overcome, and the problems of performance reduction, service life shortening and the like of the product due to high temperature are effectively solved while the user experience is obviously improved.

Description

technical field [0001] The present invention relates to the field of head-mounted smart terminals, in particular to a heat dissipation structure for head-mounted AR or VR smart terminals. Background technique [0002] In order to improve the functional experience effect of users on mobile smart terminal products, major manufacturers continue to develop various new functions and improve performance for smart terminal products, while constantly thinning and compacting the product structure, which also brings serious problems to the products. heat dissipation challenges; with the advent of the 5G era, the dramatic increase in data processing tasks has exacerbated the heat dissipation problem of smart terminal products. [0003] The existing heat dissipation method of smart terminal products is generally to use thermal interface materials, heat pipes or vapor chambers to export the chip heat to the casing, use the casing and graphite sheets to dissipate heat and equalize the tem...

AI Technical Summary

Problems solved by technology

[0004] For some head-mounted intelligent terminal products with complex structures and irregular shapes, such as AR / VR, due to their complex internal structure, their shells are not as regular as mobile phones. However, it is difficult to effectively spread the heat from the heat source to the casing for uniformity and heat dissipation; in addition, the casing material of AR / VR products is usually plastic, and the thermal conductivity is also poor. It is difficult for the heat generated by the chip to dissipate quickly through the plastic casing; even It is to use a metal case, and its ability to dissipate heat to the outside is also very limited. This may cause the temperature of the chip to rise to the point of overheating in a short period of time, triggering the overheating protection program, triggering frequency reduction and frame reduction, and also causing poor performance. sensory experience, which seriously affects the user's sense of experience

[0005] In the prior art, fans are also used to dissipate heat. For example, the patent document of publication number CN205958846U subject titled a compact wireless VR / AR helmet adopts a heat dissipation structure in which a fan is matched with a heat pipe radiator, although this heat dissipation method can well Solve the heat dissipation problem of the product, but there are still many problems such as noise and dust

[0006] Therefore, prior art still needs to improve and develop

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