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Chip-level integrated microfluidic cooling module and preparation method

A technology of heat dissipation module and microfluid, which is applied in semiconductor/solid state device manufacturing, semiconductor device, electric solid state device, etc., can solve the problem of low reliability of chip heat dissipation module, achieve volume reduction, improve heat dissipation capacity, and improve reliability Effect

Active Publication Date: 2022-03-25
SHANGHAI XIANFANG SEMICON CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a chip-level integrated microfluid cooling module and its preparation method to solve the problem of low reliability of existing chip cooling modules

Method used

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  • Chip-level integrated microfluidic cooling module and preparation method
  • Chip-level integrated microfluidic cooling module and preparation method
  • Chip-level integrated microfluidic cooling module and preparation method

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preparation example Construction

[0042] In order to realize the above idea, the present invention provides a chip-level integrated microfluidic heat dissipation module and a preparation method, wherein the chip-level integrated microfluidic heat dissipation module includes: a package body and a substrate layer arranged on top of each other; The body has a first semi-open three-dimensional chamber on the side facing the substrate layer; a liquid cooling plate is accommodated in the first semi-open three-dimensional chamber; wherein the liquid cooling plate is facing the package One side of the body has a second semi-open three-dimensional chamber; the heat source chip is accommodated in the second semi-open three-dimensional chamber; the side of the liquid cooling plate facing the substrate layer has a first vertical through-hole A microchannel and a second vertical penetrating microchannel; the substrate layer has a third vertical penetrating microchannel, and the third vertical penetrating microchannel is res...

Embodiment 3

[0056] This embodiment also provides a method for preparing a chip-level integrated microfluidic heat dissipation module, such as Figures 2 to 10 As shown, the preparation method of the chip-level integrated microfluidic heat dissipation module includes: performing etching on the first surface of the liquid cooling plate 10 to form a second semi-open three-dimensional chamber 21; The heat source chip 20 is placed in the three-dimensional chamber 21; the second semi-open three-dimensional chamber 21 is sealed; the second surface of the liquid cooling plate 10 is etched to form the first vertical through-microchannel 12 and the second Vertically penetrating microchannel 13; providing a substrate layer 30, etching the substrate layer 30 to form a third vertical penetrating microchannel 31; aligning the third vertical penetrating microchannel 31 with the first vertical penetrating microchannel 12 and the second vertical penetration microchannel 13, the substrate layer 30 and the ...

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Abstract

The invention provides a chip-level integrated microfluidic heat dissipation module and a preparation method thereof. The chip-level integrated microfluidic heat dissipation module includes: a package body and a substrate layer stacked up and down; the package body located on the upper layer faces the substrate layer One side has a first semi-open three-dimensional chamber; a liquid cold plate is accommodated in the first semi-open three-dimensional chamber; wherein the liquid cold plate has a second half on the side facing the package An open three-dimensional chamber; a heat source chip is accommodated in the second semi-open three-dimensional chamber; the side of the liquid cooling plate facing the substrate layer has a first vertically penetrating microchannel and a second vertically penetrating microchannel channel; the substrate layer has a third vertically penetrating microchannel, and the third vertically penetrating microchannel respectively communicates with the first vertically penetrating microchannel and the second vertically penetrating microchannel to form a three-dimensional vertical structure microchannel system, and the cooling liquid flow in the three-dimensional vertical microfluidic system.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a chip-level integrated microfluidic heat dissipation module and a preparation method. Background technique [0002] With the rapid development of semiconductor technology, transistor density continues to increase, chip performance continues to improve, chip power and heat flux density are increasing, and chip heat dissipation capacity has become a key factor restricting the further development of Moore's Law. The traditional heat dissipation method uses liquid cooling or air cooling to dissipate heat for the packaged chip through the heat sink. The heat conduction of the functional layer on the chip surface needs to pass through a large number of intermediate thermal resistances such as the chip substrate, chip package, thermal grease and heat sink. Reaching the refrigeration medium, and because of the integration of a variety of heterogeneous materials, it is prone to a ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/473H01L23/31H01L21/50H01L21/56
CPCH01L23/473H01L23/3107H01L21/50H01L21/56H01L2224/18H01L2224/16245H01L2924/10158H01L2924/10157H01L2224/48091H01L2224/32145H01L2924/15153H01L2924/00014
Inventor 王国军曹立强
Owner SHANGHAI XIANFANG SEMICON CO LTD