Can roll, long-substrate processing device, and method for managing long-substrate processing device

Abstract

To provide a can roll in which a cooling gas does not leak from a non-wrapped region of the can roll on which a long substrate is not wound, and a long-substrate processing device that uses the can roll. A can roll provided with a gas release mechanism for supplying a gas selectively to a plurality of gas introduction channels provided to the can roll via a rotary joint constituted from a rotatingring unit 21 and a fixed ring unit 22, wherein an arc-shaped packing member 42 fitted into an annular recessed groove 27a of the fixed ring unit is urged toward a rotating opening 23a of the rotatingring unit by a piston member of a packing attachment fixture 43 and attached, the rotating opening is blocked, and gas leakage from the non-wrapped region is prevented. The stroke range of a piston shaft 91 of the piston member is also restricted, and the distal end of the piston shaft 91 does not protrude toward the rotating opening even when the arc-shaped packing member is worn, and damage tothe rotating opening can therefore be prevented.

Description

technical field [0001] The present invention relates to performing ion beam processing in a state where a long substrate such as a long heat-resistant resin film conveyed in a roll-to-roll manner in a vacuum chamber is wound around the outer peripheral surface of a can roll An elongated substrate processing apparatus for surface treatment that applies a heat load such as sputtering film formation, and particularly relates to a drum having a gas release mechanism with a high cooling effect and capable of suppressing gas leakage from the outer peripheral surface of a drum roll on which an elongated substrate is not wound. Improvement of a roller and a long substrate processing apparatus using the can roller. Background technique [0002] Flexible wiring substrates are used in liquid crystal panels, notebook computers, digital cameras, mobile phones, and the like. The flexible wiring board is produced from a heat-resistant resin film with a metal film formed by forming a metal...

AI Technical Summary

Problems solved by technology

[0012] However, for the method of Patent Document 5, which uses the film surface to press the valve protruding and retracting from the outer peripheral surface of the can roll to open the gas release port, slight damage or depression may occur on the film surface due to the contact of the valve. Difficult to use in the manufacture of flexible wiring boards that require high-quality electronic equipment

In addition, in the method of Patent Document 6 in which a cover is attached to a region where the film is not wound (non-wrapped region) inside the outer peripheral surface of the can roll, in a processing apparatus that forms a film at a high vacuum degree, the gas It is easy to leak from the gap between the cover and the outer peripheral surface of the can roll. Therefore, it is difficult to adopt the method of Patent Document 6 similarly to the method of Patent Document 5.

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