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A thermometer decoding structure applied to high speed dac circuit

A thermometer code and thermometer technology, which is applied to thermometers, thermometers with analog-to-digital converters, and parts of thermometers, etc., can solve the problems of high-speed DAC circuit design complexity, output signal harmonic distortion, etc., to reduce layout area, The effect of increasing the operating frequency and improving the dynamic performance

Active Publication Date: 2021-11-23
迅芯微电子(苏州)股份有限公司
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Problems solved by technology

[0004] The purpose of the present invention is to provide a thermometer decoding structure applied to the high-speed DAC circuit, which can significantly reduce the complexity of the layout, in view of the problems that the design of the high-speed DAC circuit in the above-mentioned prior art is relatively complicated, and the output signal is prone to harmonic distortion , with a simpler structure to bring better high-frequency performance, improve the dynamic performance of the circuit and SFDR

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  • A thermometer decoding structure applied to high speed dac circuit
  • A thermometer decoding structure applied to high speed dac circuit
  • A thermometer decoding structure applied to high speed dac circuit

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Embodiment Construction

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of them.

[0021] Based on the embodiments of the present invention, those skilled in the art can make some simple modifications and embellishments without creative work, and all other obtained embodiments also belong to the protection scope of the present invention.

[0022] Reference in the present invention to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the example can be included in at least one embodiment of the present invention. The presentation of this phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are independent or alternative embod...

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Abstract

A thermometer decoding structure applied to high-speed DAC circuits, including two thermometer decoders, which divide the high-speed DAC circuit unit weighted high 4-bit data into the highest 2-bit binary code and the second highest 2-bit binary code and input two The thermometer decoder obtains two groups of 3-digit thermometer codes with different weights; the two thermometer decoders are respectively connected to the DEM module, and the DEM module randomly scrambles the 3-digit thermometer code; the two thermometer decoders are connected The data gating module of the weight unification processing array obtains 15 thermometer codes with consistent weights through the weight unification processing array. The invention can not only reduce the scale of the circuit, reduce the layout area, but also improve the high-frequency performance of the circuit, suppress the harmonic distortion in the output signal, have higher working speed and driving ability, reduce the influence of parasitic capacitance, and improve the performance of the circuit. working frequency.

Description

technical field [0001] The invention belongs to the field of DAC circuit design, and in particular relates to a thermometer decoding structure applied to a high-speed DAC circuit. Background technique [0002] A digital-to-analog converter (DAC) is a circuit that converts digital signals into analog signals. In recent years, with the development of microelectronics technology and the advancement of circuit design technology, high speed current steering DAC chips with a sampling rate of GSps (Sample-per-second) have attracted more and more attention. In communication system applications, adopting high-speed, high-performance DAC chips not only greatly simplifies the system structure, but also improves the flexibility and portability of system design. It is for this reason that in many fields, high-speed, high-performance DAC chips are gradually replacing traditional analog circuits and becoming a new research hotspot in system solutions. These application areas include broa...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01K1/00H03M13/00
CPCG01K1/00G01K2219/00H03M13/6502
Inventor 王潜陈莲单艳
Owner 迅芯微电子(苏州)股份有限公司
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