Light emitting subassembly arrangement having vertically mounted monitoring photodiode
A laser diode and diode technology, applied in the field of optical communication, can solve the problems of increasing manufacturing complexity and cost, etc.
Pending Publication Date: 2020-06-09
APPLIED OPTOELECTRONICS
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Problems solved by technology
However, including hermetic components in a space-constrained housing increases manufacturing complexity, cost and creates several non-trivial challenges
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[0104] As mentioned above, certain light emitting subassemblies can have a transmission distance of up to 10 kilometers or more. This light emitting subassembly is applicable to CFP (C form-factor pluggable), CFP2, CFP4 and QSFP (quad small form-factor pluggable) applications. Typically, such light emitting subassemblies comprise a hermetic package (or housing) with an LC receptacle (or other suitable connection port) for optical coupling. Hermetic packages can accommodate laser packages such as electro-absorption modulator integrated lasers (EML), power monitoring photodiodes (photodiodes, PDs), thermoelectric coolers (thermoelectric coolers, TECs), such as Arrayed waveguide gratings (arrayed waveguide grating, AWG) and optical multiplexers for multiplexing multiple channel wavelengths, electrical interconnects such as flexible printed circuit boards, and optical interconnects such as fiber stubs connector. Hermetic packages can contain cavities specifically designed to acc...
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The invention relates to a multi-channel light emitting subassembly. The multi-channel light emitting sub-assembly is provided with a vertically mounted monitoring photodiode so as to reduce the sizeof the light emitting subassembly shell and improve the quality of a radio frequency driving signal. In particular, the light emitting subassembly shell includes at least one vertical monitoring photodiode mounting surface extending substantially laterally relative to a laser diode mounting surface so that a monitoring photodiode mounted on the vertical monitoring photodiode mounting surface is positioned above an associated laser diode coupled to the laser diode mounting surface. The vertically mounted monitoring photodiode is enabled to be adjacent to the laser diode and used for mounting the monitoring photodiode to be utilized to pattern the conductor radio frequency line to provide radio frequency drive signals to the laser diode. Thus the conductor radio frequency line can extend from below the vertically mounted monitoring photodiode to a location near the laser diode so that wire bonding between them can be shortened.
Description
technical field [0001] The present invention relates to optical communication, and more particularly to a transmitter optical subassembly (TOSA) configuration with vertically mounted monitor photodiodes to reduce housing size and improve radio frequency (RF) drive signal quality. Background technique [0002] Optical transceivers can be used to send and receive optical signals for but not limited to various applications such as internet data center, cable TV broadband and fiber to the home (FTTH). For example, transmission with optical transceivers can provide higher speeds and greater bandwidth over longer distances than transmission with cables made of copper. In order to provide higher speeds in space-constrained optical transceiver modules, challenges such as thermal management, insertion loss, RF drive signal quality, and yield have been faced. [0003] An optical transceiver module typically includes one or more optical transmit subassemblies for transmitting optical ...
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IPC IPC(8): G02B6/42
CPCG02B6/4286G02B6/4245G02B6/4279
Inventor 林恺声王修哲刘凯文
Owner APPLIED OPTOELECTRONICS