A method for driving ic to pick up chip

Abstract

The invention discloses a method for taking a chip from a driving IC. The driving IC includes a chip, a PI protective layer covering the surface of the chip and colloid covering the surface of the PI protective layer. The method includes the following steps: placing the driving IC at a temperature not higher than 50 Take it out after standing in the fuming nitric acid at ℃ for a period of time; soak the driver IC taken out of the fuming nitric acid in diamine reagent until the PI protective layer and colloid on the chip are completely removed, and then take out the chip. In this method, the traditional boiling fuming nitric acid is replaced by lukewarm fuming nitric acid to reduce the reaction rate with the colloid, and prevent the shrinkage and deformation of the colloid from pulling the metal wiring on the flexible circuit board and causing the gold bump to fall off; The diamine reagent that can dissolve the PI protective layer covering the surface of the chip further cleans the chip, so that the PI protective layer and colloid are completely removed, and a clean chip is obtained; through the temperature and standing time of fuming nitric acid and diamine reagent Further restrictions such as to ensure that the chip is cleaned intact in the shortest possible time.

Description

technical field [0001] The invention relates to the technical field of display screens, in particular to a method for driving ICs to pick up chips. Background technique [0002] Existing display driver ICs basically adopt COF packaging technology, that is, the chip is bonded to a flexible circuit board, and after bonding, it is covered and packaged with colloid. [0003] When the driver IC fails, it is necessary to remove the chip and clean the driver IC to obtain a clean and complete sample for subsequent testing. The traditional method of taking the chip from the driver IC is: put the driver IC in boiling (about 90°C) fuming nitric acid and let it stand; when the gel of the driver IC is separated from the chip, take out the chip and place it in dilute sulfuric acid and use ultrasonic waves Clean until the chips are clean. [0004] Using the above traditional method, there are the following problems: 1. When the colloid used to paste the chip encounters high-temperature f...

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Problems solved by technology

[0004] Using the above traditional method, there are the following problems: 1. When the colloid used to paste the chip encounters high-temperature fuming nitric acid, it shrinks and deforms, so that the metal wiring on the flexible circuit board is pulled, and then drives the connection with the bonding wire 2. In the process of ultrasonic cleaning the chip, it is easy to cause the chip to collide with the cleaning container due to vibration, which will cause the gold bump to fall off; 3. For the surface of the chip covered with PI The driver IC of the protective layer cannot remove the PI protective layer

[0005] To sum up, it can be seen that the traditional method is not thorough enough to clean the chip, and the gold bumps are prone to fall off, which cannot guarantee the integrity of the chip, making it impossible to continue the follow-up experiment

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