Nano-silver conductive ink and low-temperature sintering method thereof

A conductive ink, low-temperature sintering technology, applied in ink, household utensils, applications, etc., can solve the problems of ink sintering temperature rise, high resistance, poor conductivity, etc., and achieve the effect of excellent conductivity

Active Publication Date: 2020-06-12
四川睿欧莱资科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In recent years, nano-silver conductive ink for inkjet printing has shown great application potential in PCB circuit boards, RFID antennas, display electrode components, etc. However, its development still faces two problems: one is that nano-silver conductive ink is Compared with the copper film / copper wire on the traditional circuit board, the formed film layer / line has higher resistance; the second is the rapid development of flexible electronics, which requires nano-silver conductive ink to achieve low temperature sintering while having excellent conductivity.
In order to achieve a stable dispersion of nano-silver ink, in addition to solvents, pH regulators, and humectants, surfactants and dispersion stabilizers must be added to the ink, which will also lead to an increase in the sintering temperature of the ink and poor conductivity

Method used

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  • Nano-silver conductive ink and low-temperature sintering method thereof
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  • Nano-silver conductive ink and low-temperature sintering method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0034] Add 4.3g of potassium citrate and 8g of glucose into 50 mL of deionized water in turn, magnetically stir at 800 rpm for 20 min at room temperature, then add 6g of polyacrylic acid to it to obtain mixed solution A; dissolve silver nitrate in deionized water A solution B with a concentration of 10 mol / L was obtained. Add 10 mL of solution B dropwise to solution A at a rate of 30 drops / min, stir magnetically for 20 min, and then react in a water bath at 60°C for 60 min, maintaining a magnetic stirring rate of 800 rpm. Then cool naturally at room temperature and keep magnetic stirring. After the product is allowed to stand, the supernatant is discarded to obtain silver nanoparticles.

[0035] After utilizing the polyaluminum chloride aqueous solution of 3mol / L to dissolve nano-silver particle, add the dehydrated alcohol of three times of deionized water volume wherein, 8000rpm centrifugal 10 minutes, repeat three times. Then the nano-silver particles were first dissolved ...

Embodiment 2

[0040] Add 4.3g of potassium citrate and 8g of glucose into 50mL of deionized water in turn, magnetically stir at a speed of 800rpm at room temperature for 20min, then add 6g of polyacrylic acid to it to obtain mixed solution A; dissolve silver nitrate in deionized water to obtain a concentration of 10mol / L solution B. Add 10 mL of solution B dropwise to solution A at a rate of 30 drops / min, stir magnetically for 20 min, and then react in a water bath at 60°C for 60 min, maintaining a magnetic stirring rate of 800 rpm. Then cool naturally at room temperature and keep magnetic stirring. After the product is allowed to stand, the supernatant is discarded to obtain silver nanoparticles.

[0041]After utilizing the polyaluminum chloride aqueous solution of 1mol / L to dissolve nano-silver particle, add the dehydrated alcohol three times of deionized water volume wherein, 8000rpm centrifuges 10 minutes, repeats three times. Then the nano-silver particles were first dissolved in dei...

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Abstract

The invention discloses a nano-silver conductive ink and a low-temperature sintering method thereof. According to the method, nano-silver particles are prepared by using double protective agents, theprepared nano-silver particles are treated by using a polyaluminum chloride solution, and the nano-silver ink is subjected to auxiliary sintering treatment by using ultraviolet irradiation and HCl solutions with different concentrations. By adopting the method, the sintering temperature of the nano-silver conductive ink is low, the morphology of the sintered conductive ink is uniform and complete,and the conductivity of the sintered silver layer is excellent.

Description

technical field [0001] The invention belongs to the technical field of nano-silver conductive ink, in particular to a nano-silver conductive ink and a low-temperature sintering method thereof. Background technique [0002] In recent years, nano-silver conductive ink for inkjet printing has shown great application potential in PCB circuit boards, RFID antennas, display electrode components, etc. However, its development still faces two problems: one is that nano-silver conductive ink is Compared with the copper film / copper wire on the traditional circuit board, the formed film layer / line has higher resistance; secondly, the rapid development of flexible electronics requires nano-silver conductive ink to achieve low-temperature sintering while having excellent conductivity. . The self characteristics of silver conductive ink for inkjet printing make the problems of these two aspects become increasingly prominent. [0003] First, the silver particles in the ink for inkjet pri...

Claims

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Application Information

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IPC IPC(8): C09D11/52B22F3/10
CPCC09D11/52B22F3/10
Inventor 陈金菊王小明
Owner 四川睿欧莱资科技有限公司
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