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Packaging structure with groove

A packaging structure and sealing layer technology, applied in photovoltaic power generation, instruments, electrical components, etc., can solve the problems of unfavorable effective area and space utilization

Active Publication Date: 2020-06-12
WAYS TECHN CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Or design on the packaging structure, such as China Taiwan Patent No. I549290, folds the structure of the component and the packaging layer to increase the bonding interface area or area to achieve the effect of packaging, but for the needs of increasingly thinner components, these structures are unfavorable Utilization of effective area and space

Method used

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Experimental program
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Embodiment Construction

[0053] The technical content and detailed description of the present invention are now described as follows in conjunction with the accompanying drawings:

[0054] see figure 1 , a schematic diagram of the thin component package structure of the first embodiment of the present invention. As shown in the figure: the groove packaging structure of the present invention is a packaging structure of grooves made on a thin component 10. The thin component 10 includes: a substrate 1, a lower conductive layer 2, an optical component 3 and an upper conductive layer 4.

[0055] The substrate 1 is a transparent plastic or transparent glass substrate. The light-transmitting plastic is polyimide (Polyimide, PI), polyimide and inorganic mixture (hybrid PI), polyethylene terephthalate (Polyethyleneterephthalate, PET), polyethersulfone (Polyethers

[0056] Ulfone, PES), polyethylene naphthalate (Polyethylene naphthalatc, PEN)

[0057], Cyclo olefin polymer (Cyclo olefin polymer, COP), glas...

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Abstract

A packaging structure with groove includes a substrate, a lower conductive layer, an optical element, a sealing layer and a barrier layer. The lower conductive layer is arranged on one face of the substrate. The optical element is arranged on one face of the lower conductive layer. The upper conductive layer is arranged on one face of the optical element. The packaging structure further comprisesa groove defined on an inactive area of the optical element. The sealing layer is arranged on one face of the optical element and on one face of the upper conductive layer. The barrier layer is arranged on one face of the sealing layer. Because the groove is formed on inactive area of the optical element to enhance lateral sealing tightness, extended interface is provided between sealing layer / barrier layer and the substrate, thus enhance the water-resistant and gas-resistant property for package.

Description

technical field [0001] The invention relates to an electronic component packaging structure, in particular to a groove packaging structure of a thin component substrate. Background technique [0002] In view of the environmental sensitivity of electronic components, generally packaged components need to be shielded to achieve a sealed state that blocks moisture and oxygen to protect their internal environment-sensitive electronic components (such as organic light-emitting diodes or thin-film photovoltaic cells, etc.) The shielding is affected by the temperature and humidity of the external environment, so as to avoid failure or performance attenuation, and then damage the entire environment-sensitive electronic components, so as to ensure the quality and service life of the product. [0003] Commonly used encapsulation technologies such as those used in solar cell modules and OLEDs often use ethylene-vinyl acetate copolymer (EVA) with good moisture resistance as the encapsul...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/44H01L51/52G02F1/161
CPCG02F1/161H10K30/88H10K59/8731H10K59/873Y02E10/549H01L31/0481H10K50/8445
Inventor 廖世文张裕洋
Owner WAYS TECHN CORP
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