Low-temperature wire tensile test device and method

Abstract

The invention discloses a low-temperature wire tensile test device and method. The low-temperature wire tensile test device comprises a heat preservation cylinder, an inner cylinder, a pipeline, an upper connecting rod and a lower connecting rod. The heat preservation cylinder is nested outside the inner cylinder and spaced from the inner cylinder, an outer sealing cavity is formed in the gap andfilled with a low-temperature medium, the bottom of the outer sealing cavity is communicated with the interior of the inner cylinder through a pipeline, and a valve is arranged on the pipeline; the bottom of the upper connecting rod is coaxially connected with the top of a wire connecting rod, a tension sensor is arranged at the joint of the upper connecting rod and the wire connecting rod, a displacement sensor is arranged on the wire connecting rod, the bottom of the wire connecting rod penetrates through the top of the inner cylinder to be located in the inner cylinder, and the wire connecting rod is connected with a sealing piston at the top of the inner cylinder; the top of the lower connecting rod penetrates through the bottom of the inner barrel and is located in the inner barrel, and a wire clamp is arranged at the top of the lower connecting rod. And the wire member can be subjected to a tensile test in a low-temperature environment.

Description

technical field [0001] The invention belongs to the field of metal material testing, and relates to a low-temperature wire tensile testing device and method. Background technique [0002] At present, with the continuous development of smart materials, traditional test instruments cannot meet special test conditions. In actual research, it takes a lot of money to meet special conditions, and traditional equipment is also unstable in special environments, such as ultra-low temperature environments. Ultra-low temperature media are costly and volatile, so the existing test environment reaches ultra-low temperature. It requires a lot of financial and material resources, and it is difficult to ensure the stability and controllability of the temperature, resulting in the inability to guarantee the accuracy of the test. Considering the convenience of research, it is necessary to develop a small and low-cost test device to meet the needs of low temperature testing. Contents of the ...

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Problems solved by technology

[0002] At present, with the continuous development of smart materials, traditional test instruments cannot meet special test conditions

In actual research, it takes a lot of money to meet special conditions, and traditional equipment is also unstable in special environments, such as ultra-low temperature environments. Ultra-low temperature media are costly and volatile, so the existing test environment reaches ultra-low temperature. It requires a lot of financial and material resources, and it is difficult to ensure the stability and controllability of the temperature, resulting in the inability to guarantee the accuracy of the test. Considering the convenience of research, it is necessary to develop a small and low-cost test device to meet the needs of low temperature testing.

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