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Assembly for semiconductor lithography and method of manufacturing the same

A semiconductor and lithography technology, applied in the field of components for semiconductor lithography and their manufacturing, which can solve problems such as complete failure of components, stability problems, etc.

Active Publication Date: 2022-05-24
ASML HLDG NV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Also, because the epoxy creeps under load, this creates long-term stability issues
Epoxies are also known not to adhere to glass or metal substrates and cause complete failure of the assembly

Method used

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  • Assembly for semiconductor lithography and method of manufacturing the same
  • Assembly for semiconductor lithography and method of manufacturing the same
  • Assembly for semiconductor lithography and method of manufacturing the same

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Embodiment Construction

[0036] This specification discloses one or more embodiments incorporating various features of the subject matter disclosed and claimed herein. The disclosed embodiments are merely illustrative of the subject matter. The scope of the present invention is not limited to the disclosed embodiments. The invention is defined by the appended claims.

[0037] The described embodiments and references in the specification to "one embodiment," "an embodiment," "exemplary embodiment," etc. mean that the described embodiment may include a particular feature, structure, or characteristic, but each Examples may not necessarily include the particular feature, structure or characteristic described. Moreover, these phrases are not necessarily referring to the same embodiment. Furthermore, when a particular feature, structure or characteristic is described in conjunction with one embodiment, it should be understood that it is within the knowledge of those skilled in the art to implement such ...

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Abstract

An optical component and a method of manufacturing the optical component, wherein a support structure is formed directly on an optical element, or directly on a carrier, using additive manufacturing techniques, and subsequently bonded to the optical element.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS [0002] This application claims priority to US Provisional Patent Application No. 62 / 578,572, filed on October 30, 2017, the entire contents of which are incorporated herein by reference. technical field [0003] The present disclosure relates to components such as may be used in a lithographic apparatus and methods of fabricating and aligning such components. Background technique [0004] A lithographic apparatus is a machine that applies a desired pattern to a substrate such as a wafer of semiconductor material, usually on a target portion of the substrate. A patterning device, alternatively referred to as a mask or reticle, may be used to generate circuit patterns to be formed on a single layer of a wafer. Transfer of the pattern is typically accomplished by imaging the pattern onto a layer of radiation-sensitive material (resist) disposed on the substrate. Typically, a single substrate will contain adjacent target portion...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20G02B7/00G02B5/00
CPCG03F7/7015G03F7/70825G02B7/181G03F7/70141
Inventor S·鲁C·W·里德
Owner ASML HLDG NV