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ITO rotating target binding method

A technology of rotating target and binding, applied in the direction of ion implantation plating, coating, metal material coating process, etc., can solve the problems of ITO target scrap, uneven welding layer, back tube deformation, etc., to reduce labor Operation and human error, improve safety factor, improve the effect of uniformity

Pending Publication Date: 2020-06-19
东莞市欧莱溅射靶材有限公司
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AI Technical Summary

Problems solved by technology

[0002] The use of ITO thin films is becoming more and more widespread, and the main raw material of the coating process needs to use ITO targets. According to the physical properties of the targets, the target and the back tube need to be bound and used in the actual use process, and the binding effect often affects The effect of using the target
Especially for long rotating targets, the properties of the poured metal layer evenly affect the final binding welding rate. The conventional binding method is easy to deform the back tube, and the yield rate is low.
In the existing technology, the technical process of sub-section binding can solve this problem well, but in the sub-section binding process, there are problems that the welding layer of each target section is not uniform, and the whole tube has different parts. Part of the performance is different, which seriously affects the coating quality of the ITO target, and even leads to the serious consequences of scrapping the ITO target.

Method used

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Embodiment Construction

[0037] The following are only preferred embodiments of the present invention, and therefore do not limit the protection scope of the present invention.

[0038] A method for binding an ITO rotating target, comprising the steps of:

[0039] 1) Metallization pretreatment of the ITO target tube, sending a single segment of the ITO target tube to the automatic ultrasonic indium coating equipment, including the following sub-steps.

[0040] 1.1) The high temperature box 10 of the automatic ultrasonic indium coating equipment is used to heat up the temperature of the single-section ITO target tube, and the temperature of the ITO target tube is raised to 200 °C at a heating rate of 1.2-1.6 °C / min.

[0041] 1.2) Manually add molten indium to the inner tube wall of the ITO target tube through a spoon.

[0042] 1.3) The ITO target tube is driven to rotate on its axis by means of the back-up roller device arranged in the high temperature box 10, and at the same time, the ultrasonic coat...

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Abstract

The invention discloses an ITO rotating target binding method. Compared with the prior art, the ITO rotating target binding method has the advantages that automatic ultrasonic indium coating equipment, a semi-automatic rotating target oxide skin removing device and a sectional heating device respectively participate in the metallization pretreatment step, the oxide skin removing step and the binding and welding step of each ITO target tube, so that manual operation and manual errors are reduced as much as possible, the safety coefficient and the production efficiency in a production workshop are improved, it is guaranteed that the binding conditions of all sections of the ITO target tube are the same, the uniformity of the whole target performance is improved, and the yield of products isincreased.

Description

technical field [0001] The invention relates to the technical field of target material processing, in particular to an ITO rotating target binding method. Background technique [0002] The use of ITO thin films is becoming more and more widespread, and the main raw material of the coating process needs to use ITO targets. According to the physical properties of the targets, it is necessary to bind the targets and the back tube during actual use, and the binding effect often affects The effect of using the target. Especially for long rotating targets, the performance of the poured metal layer evenly affects the final binding welding rate. The conventional binding method is easy to deform the back tube, and the yield rate is low. In the existing technology, the technical process of sub-section binding can solve this problem well, but in the sub-section binding process, there are problems that the welding layer of each target section is not uniform, and the whole tube has diff...

Claims

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Application Information

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IPC IPC(8): C23C14/34C23C14/08C23C4/08C23C4/16
CPCC23C14/3414C23C14/086C23C4/16C23C4/08
Inventor 陈明恒
Owner 东莞市欧莱溅射靶材有限公司
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