Reverse stripping electrolysis device for preventing plating metal from being separated out of conductive part of cathode conductive base

Abstract

The invention discloses a reverse stripping electrolysis device for preventing plating metal from being separated out of a conductive part of a cathode conductive base, and relates to the technical field of auxiliary equipment of cathode conductive devices. The reverse stripping electrolysis device specifically comprises a contact base and a contact rocking plate, a contact vertical base is vertically welded to one side of the upper surface of the contact base, a pasting plate is vertically welded to one side, close to the contact vertical base, of the contact bottom plate, guide piece rollerwheels are arranged on the two sides of the contact bottom plate, one end of the contact rocking plate is connected to the pasting plate, and an anti-stripping cathode conductive electrode is installed on the upper surface of the contact base and located below the guide piece roller wheels. According to the reverse stripping electrolysis device for preventing the plating metal from being separatedout of the conductive part of the cathode conductive base, the service life of the cathode conductive device is prolonged, the consumable cost is reduced, the maintenance frequency of the cathode conductive device is reduced, the safety and stability of part conduction are improved, and the stability and reliability of product quality are guaranteed.

Description

technical field [0001] The invention relates to the technical field of auxiliary equipment for a cathode conductive device, in particular to an anti-stripping electrolysis device for preventing the plating metal from being deposited on a conductive part of a cathode conductive seat. Background technique [0002] The cathode conductive device of the continuous electroplating production line generally has two ways of bottom (bottom side) and plane conduction. Regardless of the conductive mode, the surface of the metal conductive part of the conductive device is easy to form a layer of metal slag or loose rough coating ( Such as common nickel slag, tin slag, copper slag, etc.). [0003] These precipitated plating metal crystallization products will seriously affect the quality of electroplating products. For example, if the plated parts run on these rough metal slags, the poor conductivity will cause sparking, resulting in poor bonding of the plating layer, and the unstable cur...

AI Technical Summary

Problems solved by technology

[0003] These precipitated plating metal crystallization products will seriously affect the quality of electroplating products. For example, if the plated parts run on these rough metal slags, the poor conductivity will cause sparking, resulting in poor bonding of the plating layer, and the unstable current will reduce the plating efficiency. The thickness is unstable, the parts are scratched by metal slag, the coating is scratched or the parts are caught, and the product is deformed, and many other quality problems. In addition, the cleaning of metal slag on the conductive part and the maintenance frequency of the conductive device are also high. The metal slag that is difficult to remove can also easily lead to electrical conductivity. The overall use effect of the device is reduced, resulting in scrapping or greatly reducing its service life, increasing the cost of consumables

[0004] A cathode conductive seat for electroplating, a cathode conductive device for electroplating, and electroplating equipment disclosed in the Chinese invention patent application publication specification CN105714364A, although the cathode conductive seat for electroplating, the cathode conductive device for electroplating, and the electroplating equipment, although they are in the direction of the cathode conductive rod When it is installed on the V-shaped seat, the friction head on the claw and the cathode conductive rod will rub against each other to make the oxidized rust layer on the cathode conductive rod fall off, which will help the cathode conductive device maintain good conductivity; in addition , the contact between the upper end of the claw and the cathode conductive rod is equivalent to increasing the contact point between the cathode conductive seat and the cathode conductive rod, and the newly added contact point also helps to increase the conductivity of the cathode conductive device. However, the cathode conductive seat for electroplating , The electroplating cathode conductive device and electroplating equipment cannot prevent the generation of metal slag or crisp and rough coating on the cathode conductive parts

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