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Backlight module, manufacturing method thereof, and display device

A technology for backlight modules and light-emitting devices, which is applied in the fields of identification devices, semiconductor/solid-state device manufacturing, and instruments, and can solve the problems of via holes losing their overlapping function, poor electrical conductivity, and long time, and solve the problems of poor electrical conductivity of ITO and Easy to fail, reduce process steps, increase adhesion effect

Active Publication Date: 2022-04-05
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a backlight module, its preparation method, and a display device, so as to solve the technical problems in the prior art that ITO has poor electrical conductivity and the via holes lose their overlapping function due to aging after a long time or high temperature. , while effectively reducing light loss and energy consumption

Method used

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  • Backlight module, manufacturing method thereof, and display device
  • Backlight module, manufacturing method thereof, and display device
  • Backlight module, manufacturing method thereof, and display device

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Embodiment Construction

[0035] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.

[0036] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the a...

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Abstract

The application discloses a backlight module, a preparation method thereof, and a display device. The backlight module includes an array substrate and a plurality of light emitting devices arranged on the array substrate, the array substrate includes: a base substrate, and a first metal layer and a second metal layer arranged on the base substrate two metal layers; a planar layer covering the first metal layer and the second metal layer and exposing a portion of the first metal layer and a portion of the second metal layer; and, a metal stack, The portion of the first metal layer and the portion of the second metal layer that are disposed on the flat layer and contact the exposed flat layer; the metal stack includes at least one layer of the first metal, at least one layer a second metal and at least one layer of metal oxide, and the first metal is molybdenum. The second metal has high reflectivity and better conductivity than the metal oxide, which can effectively reduce light loss and achieve better conductivity.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a backlight module, a manufacturing method thereof, and a display device. Background technique [0002] With the development of display technology, Micro-LED (Micro-Light Emitting Diode, miniature light-emitting diode) has developed into one of the hot spots of future display technology, and the current LCD (Liquid Crystal Display, liquid crystal display), OLED (Organic Light Emitting Diode, organic Compared with light-emitting diode) display devices, it has the advantages of fast response, high color gamut, high PPI (Pixels Per Inch, pixel density), low energy consumption, etc.; but its technical difficulties are many and complex, especially its key technology mass transfer technology , LED (Light Emitting Diode, light-emitting diode) particle miniaturization has become a technical bottleneck, and Mini-LED (Mini-Light Emitting Diode, mini light-emitting diode), as the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/15H01L27/12H01L21/768G09F9/33
CPCH01L27/156H01L27/1244H01L27/124H01L27/1259H01L21/76838G09F9/33
Inventor 王明耀刘俊领
Owner SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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