Backlight module, manufacturing method thereof, and display device
A technology for backlight modules and light-emitting devices, which is applied in the fields of identification devices, semiconductor/solid-state device manufacturing, and instruments, and can solve the problems of via holes losing their overlapping function, poor electrical conductivity, and long time, and solve the problems of poor electrical conductivity of ITO and Easy to fail, reduce process steps, increase adhesion effect
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[0035] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.
[0036] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the a...
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