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Preparation method of interdigital electrode

A technology of interdigitated electrodes and carbon layers, which is applied to electrical components, impedance networks, etc., can solve the problems of large metal wires, poor adhesion, and collapsed patterns, so as to improve adhesion, improve molding accuracy and quality, and improve The effect of uniformity

Pending Publication Date: 2020-06-23
XIAMEN SANAN INTEGRATED CIRCUIT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Whether it is lift-off or dry etching, the use of traditional bottom anti-reflection layers often has the disadvantage of poor adhesion, which can easily cause pattern collapse, and the formed metal lines Larger line width

Method used

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  • Preparation method of interdigital electrode
  • Preparation method of interdigital electrode
  • Preparation method of interdigital electrode

Examples

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no. 1 example

[0055] see figure 1 , the present embodiment provides a method for preparing an interdigitated electrode, comprising the following steps:

[0056] S1: see figure 2 , forming a carbon layer 120 and a photoresist layer 130 sequentially on the substrate 110 .

[0057] Wherein, the substrate 110 is made of lithium niobate or lithium tantalate. The carbon layer 120 may be formed on the substrate 110 by sputtering at a temperature below 100 degrees Celsius. The thickness of the carbon layer 120 is not less than the thickness of the required metal wire, preferably 300-3000.

[0058] S2: see Figure 3 to Figure 5 , patterning the photoresist layer 130 and the carbon layer 120 to form a patterned layer 180 .

[0059] Specifically, firstly, the photoresist layer 130 is exposed and developed to form a plurality of spaced hollow areas 150 on the photoresist layer 130 . The width of the hollow area 150 is equal to the line width of the required metal line 170 . The bottom of the ho...

no. 2 example

[0071] see Image 6 , the present embodiment provides a method for preparing an interdigitated electrode, comprising the following steps:

[0072] S21: See Figure 7 , forming the metal layer 140 on the substrate 110 .

[0073] Wherein, the metal layer 140 is a preliminary material for forming the required metal wire 170, and the thickness of the metal layer 140 is equal to the thickness of the required metal wire 170. The metal layer 140 can be made of aluminum and formed by evaporation.

[0074] S22: sequentially forming a carbon layer 120 and a photoresist layer 130 on the metal layer 140 .

[0075] Wherein, the carbon layer 120 is used as an anti-reflection layer, and can also improve the adhesion of the photoresist layer 130 .

[0076] S23: See Figure 8 , exposing and developing the photoresist layer 130 to form a plurality of spaced hollow areas 150 on the photoresist layer 130 .

[0077] Wherein, forming a plurality of spaced hollow areas 150 on the photoresist la...

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Abstract

The invention provides a preparation method of an interdigital electrode, and relates to the technical field of surface acoustic wave filters. The preparation method of the interdigital electrode comprises the following steps: sequentially forming a carbon layer and a photoresist layer above a substrate; patterning the photoresist layer and the carbon layer to form a pattern layer; if the patternof the pattern layer is complementary with the pattern of the required metal wire, forming a metal layer above the substrate containing the pattern layer, and removing a part of the metal layer on thepattern layer and the pattern layer; and if the pattern of the pattern layer is the same as the pattern of the required metal wire, forming a metal layer on the substrate before the carbon layer is formed above the substrate, and then removing the part of the metal layer, which is complementary with the pattern layer. According to the method, the adhesiveness of the photoresist layer can be effectively improved, the process window of yellow light is improved, the remaining metal layer partially forms the metal line, and the line width of the formed metal line is small.

Description

technical field [0001] The invention relates to the technical field of surface acoustic wave filters, in particular to a method for preparing interdigital electrodes. Background technique [0002] Surface acoustic wave filter (SAW filter) is widely used in mobile communication, radio, cable modem, and remote control. The interdigitated electrode (IDT) is a key layer in the manufacturing process of the surface acoustic wave filter (SAW filter). At present, two methods of lift-off and dry etching are commonly used to prepare interdigitated electrodes. . [0003] Whether it is lift-off or dry etching, the use of traditional bottom anti-reflection layers often has the disadvantage of poor adhesion, which can easily cause pattern collapse, and the formed metal lines The line width is larger. Therefore, designing a preparation method of interdigitated electrodes can effectively improve the adhesion of photoresist and improve the process window of yellow light, and the line widt...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H3/08H03H9/02H03H9/145
CPCH03H3/08H03H9/02559H03H9/02968H03H9/14541
Inventor 朱庆芳蔡文必林彩文王信棋高俊华
Owner XIAMEN SANAN INTEGRATED CIRCUIT
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