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Bearing device, semiconductor equipment and residual charge detection method

A carrier device and semiconductor technology, applied in semiconductor/solid-state device testing/measurement, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as wafer position offset

Active Publication Date: 2020-06-26
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention discloses a carrying device, a semiconductor device, and a detection method for residual charges, so as to solve the problem of large positional deviation of the wafer due to incomplete deionization of the wafer

Method used

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  • Bearing device, semiconductor equipment and residual charge detection method
  • Bearing device, semiconductor equipment and residual charge detection method
  • Bearing device, semiconductor equipment and residual charge detection method

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Embodiment Construction

[0030] In order to make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be described clearly and completely in conjunction with specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0031] The technical solutions disclosed in the various embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0032] Please refer to Figure 1 to Figure 6 The embodiment of the present invention discloses a carrying device. The disclosed carrying device is used to carry a wafer 400 in a semico...

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Abstract

The invention discloses a bearing device, semiconductor equipment and a residual charge detection method. The disclosed bearing device is used for bearing a wafer (400) in semiconductor equipment, andcomprises an annular base part (100), an electrostatic bearing disc (200) and at least three positioning pieces (300). The electrostatic bearing disc (200) comprises a bearing surface (210) used forbearing the wafer (400). The annular base part (100) is arranged around the bearing surface (210). The at least three positioning pieces (300) are arranged on the annular base part (100) at intervals,each positioning piece (300) comprises a conical section (310), a limiting space is formed by the at least three conical sections (310) under the condition that the conical sections (310) protrude out of the bearing surface (210), and the opening size of the limiting space is gradually increased in the direction away from the bearing surface (210). According to the scheme, the problem that the position offset of the wafer is large due to incomplete electricity removal of the wafer can be solved.

Description

Technical field [0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a carrying device, semiconductor equipment and a residual charge detection method. Background technique [0002] The manufacturing of microelectronic devices includes many different stages, and each stage includes various processes. Etching is one of the important processes. The etching process mainly involves introducing plasma to the surface of the wafer (the material to be etched, such as silicon), corroding the wafer surface through physical and chemical effects, and then forming various required lines, holes, and grooves on the wafer. slot or other shape. [0003] In the current wafer production process, after each wafer is processed, it needs to be destaticized. The general destaticizing operation is to apply reverse voltage to the electrodes in the semiconductor equipment, ventilation and ignition, or secondary Either way, after the desta...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L21/687H01L21/66H01L21/67
CPCH01L21/6831H01L21/6833H01L21/6875H01L21/68714H01L21/68785H01L21/67253H01L22/10H01J37/32816H01J37/32449H01J37/32642H01J37/32715H01L21/68H01L21/68742H01L21/68735H01L21/67069H01J37/32697H01J2237/182H01J2237/2007H01J2237/20235H01J2237/24564H01J2237/334
Inventor 刘建
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD