Organ chip with multi-layer combined structure and using method thereof
A technology of organ chips and combined structures, which is applied in chemical instruments and methods, methods for stress-stimulated microbial growth, laboratory containers, etc., can solve problems such as high cost, increased difficulty, uneven cell inoculation, etc., and achieve low cost , reduce complexity, design flexible and changeable effects
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0037] like Figure 1-3 An organ chip with a multi-layer composite structure is shown, and the organ chip includes a three-layer composite structure from bottom to top, including a bottom base structure 100, a first middle layer 300 and a top cover structure 200; the bottom base structure 100 Both the first middle layer structure 300 and the first middle layer structure 300 are hollow containers without a cover with a certain wall thickness, and the top layer cover structure 200 is composed of a top cover 210 and a plug 220 below the top cover 210; the first middle layer 300 can be embedded Set on the bottom base structure 100, and form the first culture space 10 at the bottom; the top cover structure 200 can be nested on the middle layer 300 through the plug 220, and form the second culture space 20 at the bottom; Two bottom wall grooves 101 are symmetrically opened on the wall of the bottom base structure 100; first middle layer wall grooves 301 are symmetrically opened on t...
Embodiment 2
[0040] like Figure 4-5 In the organ chip of a multi-layer composite structure shown, on the basis of the structure of Embodiment 1, there is a second intermediate layer 400 on the first intermediate layer 300; the second intermediate layer 400 can be embedded Set on the first middle layer 300, and form the third cultivation space 30 at the bottom; the top cover structure 200 covers the second middle layer 400; the wall of the second middle layer 400 is symmetrically opened with The second intermediate layer wall groove 401; the top wall opening part of the second intermediate layer 400 has a second ring structure 410 larger than the diameter of its container; the second ring structure 410 is provided with a second intermediate layer through hole group One 411 and the second middle layer through hole group two 412; when the second middle layer 400 is nested on the first middle layer 300, the second middle layer through hole group one 411 and the first middle layer 300 is conn...
Embodiment 3
[0043] like Figure 6 In the organ chip with a multi-layer composite structure shown, on the basis of the structure of Embodiment 2, there is a third intermediate layer 500 on the second intermediate layer 400, and the third intermediate layer 500 can be nested On the second middle layer 400, a fourth cultivation space 40 is formed at the bottom; the top cover structure 200 covers the third middle layer 500; Three intermediate layer wall grooves 501; the top wall opening part of the second intermediate layer 400 has a third ring structure 510 larger than the container diameter; the third ring structure 510 is provided with a third intermediate layer through hole group one 511 and the third middle layer through hole group two 512 and the third middle layer through hole group three 513; when the third middle layer 500 is nested on the second middle layer 400, the third middle layer through hole group One 511 communicates with the second middle layer wall groove 401 of the secon...
PUM
Property | Measurement | Unit |
---|---|---|
depth | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
width | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com