Organ chip with multi-layer combined structure and using method thereof

A technology of organ chips and combined structures, which is applied in chemical instruments and methods, methods for stress-stimulated microbial growth, laboratory containers, etc., can solve problems such as high cost, increased difficulty, uneven cell inoculation, etc., and achieve low cost , reduce complexity, design flexible and changeable effects

Pending Publication Date: 2020-07-03
苏州济研生物医药科技有限公司
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of operation increases the difficulty of the user's operation to a certain extent, thus causing problems such as uneven cell inoculation and cross-contamination.
In addition, the current organ chip mainly uses the elastic material PDMS as the main material, which has a long production cycle and high cost. At the same time, the chip also needs cumbersome operations such as drilling and intubation.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Organ chip with multi-layer combined structure and using method thereof
  • Organ chip with multi-layer combined structure and using method thereof
  • Organ chip with multi-layer combined structure and using method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] like Figure 1-3 An organ chip with a multi-layer composite structure is shown, and the organ chip includes a three-layer composite structure from bottom to top, including a bottom base structure 100, a first middle layer 300 and a top cover structure 200; the bottom base structure 100 Both the first middle layer structure 300 and the first middle layer structure 300 are hollow containers without a cover with a certain wall thickness, and the top layer cover structure 200 is composed of a top cover 210 and a plug 220 below the top cover 210; the first middle layer 300 can be embedded Set on the bottom base structure 100, and form the first culture space 10 at the bottom; the top cover structure 200 can be nested on the middle layer 300 through the plug 220, and form the second culture space 20 at the bottom; Two bottom wall grooves 101 are symmetrically opened on the wall of the bottom base structure 100; first middle layer wall grooves 301 are symmetrically opened on t...

Embodiment 2

[0040] like Figure 4-5 In the organ chip of a multi-layer composite structure shown, on the basis of the structure of Embodiment 1, there is a second intermediate layer 400 on the first intermediate layer 300; the second intermediate layer 400 can be embedded Set on the first middle layer 300, and form the third cultivation space 30 at the bottom; the top cover structure 200 covers the second middle layer 400; the wall of the second middle layer 400 is symmetrically opened with The second intermediate layer wall groove 401; the top wall opening part of the second intermediate layer 400 has a second ring structure 410 larger than the diameter of its container; the second ring structure 410 is provided with a second intermediate layer through hole group One 411 and the second middle layer through hole group two 412; when the second middle layer 400 is nested on the first middle layer 300, the second middle layer through hole group one 411 and the first middle layer 300 is conn...

Embodiment 3

[0043] like Figure 6 In the organ chip with a multi-layer composite structure shown, on the basis of the structure of Embodiment 2, there is a third intermediate layer 500 on the second intermediate layer 400, and the third intermediate layer 500 can be nested On the second middle layer 400, a fourth cultivation space 40 is formed at the bottom; the top cover structure 200 covers the third middle layer 500; Three intermediate layer wall grooves 501; the top wall opening part of the second intermediate layer 400 has a third ring structure 510 larger than the container diameter; the third ring structure 510 is provided with a third intermediate layer through hole group one 511 and the third middle layer through hole group two 512 and the third middle layer through hole group three 513; when the third middle layer 500 is nested on the second middle layer 400, the third middle layer through hole group One 511 communicates with the second middle layer wall groove 401 of the secon...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
depthaaaaaaaaaa
thicknessaaaaaaaaaa
widthaaaaaaaaaa
Login to view more

Abstract

The invention belongs to the field of organ chips, and particularly discloses an organ chip with a multi-layer combined structure and a using method thereof. The organ chip at least comprises a three-layer combined structure from bottom to top, namely a bottom-layer substrate structure (100), at least one first middle layer (300) and a top-layer cover structure (200), multi-organ cell inoculationcan be carried out, and cell inoculation and short-term static culture can be independently carried out on the bottom layer and the middle layer. After the cells are adhered and grow, the bottom layer, the middle layer and the top layer cover are combined, independent culture chambers are formed between the layers, dynamic perfusion culture can be carried out on each chamber, and meanwhile substance exchange can be carried out between the chambers through porous membranes. The organ chip can be applied to research work in the fields of biomedicine, new drug research and development, toxicologyand the like.

Description

technical field [0001] The invention belongs to the field of organ chips, and specifically discloses an organ chip with a multilayer composite structure and a method for using the same. Background technique [0002] In the past ten years, with the convergence of microfluidic technology and biotechnology, organ-on-a-chip technology based on tissue and organ culture based on microfluidic technology has become one of the hotspots in the fields of biomedicine and drug research and development. Organ-on-a-chip technology can precisely control the space and fluids in the chip, so as to realize the construction of tissue and organ modules with bionic effects in the chip. At present, researchers have developed a variety of organ chips, including: liver, intestine, lung, blood vessel, blood-brain barrier (BBB), kidney, etc. Therefore, the development of organ-on-a-chip technology will help biomedicine, drug development and other fields. [0003] However, the current organ chip is s...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C12M3/00C12M3/06B01L3/00
CPCC12M21/08C12M23/16C12M23/38C12M23/42C12M29/10C12M35/08B01L3/5027
Inventor 魏文博王丽王南冯可
Owner 苏州济研生物医药科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products