Packaging device and method based on anodic bonding
A technology for anodic bonding and packaging devices, which is applied in microstructure devices, manufacturing microstructure devices, and processes for producing decorative surface effects, and can solve problems such as affecting the vacuum degree of packaging cavities.
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Embodiment 1
[0040] figure 2 , image 3 and Figure 4 Respectively show the front view structural schematic diagram, the front cross-sectional structural schematic diagram and the left view structural schematic diagram of the cross-electrode silicon glass anodic bonding packaging device in the prior art.
[0041] Such as Figure 2-4 As shown, when the prior art is packaged in the way of anodic bonding across electrodes, the end of the electrode 3 is located outside the bonding interface, so that one end of the electrode is exposed to the external atmosphere. If the end of the electrode 3 is located at the anodic bonding interface The outside, that is, the electrode 3 is exposed to the atmosphere. When the silicon wafer 1 and the glass wafer 4 are anodically bonded, there is a gap 8 between the bonding interface and the electrode 3, and the two ends of the gap 8 are respectively connected to the outside air and the package. The cavity 5 is turned on, so that outside air enters the packag...
Embodiment 2
[0057] Figure 11 A schematic diagram of the steps of the packaging method based on anodic bonding according to the embodiment of the present application is shown in .
[0058] Such as Figure 11 As shown, the packaging method based on anodic bonding provided in this embodiment includes the following steps:
[0059] S101: disposing the chip and the electrode on the silicon wafer part, and connecting the chip and the electrode;
[0060] S102: Perform anodic bonding of the silicon wafer part and the glass wafer part to package the chip and the electrode, so that one end of the electrode is arranged at the contact surface of the silicon wafer part and the glass wafer part;
[0061] S103: providing a conductive channel inside the glass sheet part, the first opening of the conductive channel is arranged at the electrode of the contact surface, and the second opening of the conductive channel is arranged on the outer surface of the glass sheet part;
[0062] S104: setting a condu...
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