A substrate electroplating method and substrate prepared therefrom

Abstract

The invention provides a substrate electroplating method, the substrate includes a plurality of circuit board units, the method includes the following steps: providing a substrate, the substrate includes an insulating layer and a metal layer; forming a barrier layer on the metal layer, The barrier layer has a first opening and a second opening, the first opening corresponds to the area to be electroplated of the circuit board unit, the second opening corresponds to the compensation plating area; the second opening The window is arranged in the waste area of ​​the substrate; electroplating is performed on the substrate; wherein, the area distribution of the compensation electroplating area is adjusted according to the distribution of the current density of the substrate before compensation. The method of the invention has a simple compensation process, improves the uniformity of the electroplated metal in the area to be electroplated, the etching yield of the circuit board, and the controllability of manufacturing, and at the same time reduces energy consumption and saves costs.

Description

technical field [0001] The invention relates to the field of circuit board manufacturing, in particular to a substrate electroplating method and a substrate prepared therefrom. Background technique [0002] With the birth and development of circuit boards, the circuit patterns of circuit boards are becoming more and more complex, the lines are getting thinner, and the requirements for the uniformity of the thickness of the electroplated metal are also getting higher and higher. At present, in order to solve the problem of poor uniformity of electroplated metal thickness, a uniform compensation method is usually adopted for the substrate, but the electroplating thickness of this method is still not uniform enough, resulting in poor uniformity of subsequent etching, easy to cause poor etching, and poor process controllability, which cannot meet the current requirements. Requirements for the uniformity of metal plating thickness on circuit boards. [0003] In the prior art, wh...

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Problems solved by technology

[0004] In order to overcome the problems of poor uniformity of plated metal thickness and complicated compensation process in the prior art when the substrate is electroplated, the present invention provides a substrate electroplating method, which can simplify the compensation process, improve the uniformity of the plated metal on the substrate, and save costs at the same time

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