A method for compensating
overlay misalignment includes: providing a
wafer; performing a first pre-compensation and a second pre-compensation on a
lithography machine; forming an initial fin structure on the
wafer, wherein the sum of the compensation value of the first pre-compensation and the previous first
etching misalignment of the initial fin structure is 0; obtaining a first
etching misalignment of the initial fin structure, wherein the first
etching misalignment is the same as the compensation value of the second pre-compensation; performing a third compensation on the
lithography machine based on the first etching misalignment; performing a fourth pre-compensation on the
lithography machine; after performing the third and fourth pre-compensations on the lithography machine, partially etching the initial fin structure to form a fin structure, wherein the sum of the compensation value of the fourth pre-compensation and the compensation value of the second pre-compensation is 0, and the compensation value of the second pre-compensation is the same as the previous second etching misalignment of the fin structure; obtaining a second etching misalignment of the fin structure, wherein the value of the second etching misalignment is 0. This method improves
overlay accuracy.