Copper powder for infiltration

Abstract

The present invention provides a copper-based powder for infiltration, which becomes an infiltration material for an iron-based substrate. The infiltration material composed of the copper-based powder has a high infiltration rate and can increase the density of the iron-based substrate. It is possible to produce sintered parts of high-strength and high-toughness iron-based alloys, and since the surface of the base material is not corroded, the surface state of the base material after infiltration is good, and since no residue remains after infiltration, it is not A residue removal process is required. The present invention is a copper-based powder for infiltration, wherein the copper-based powder contains 1.5-4.0% by mass of Fe or Co and Cu, and the standard formation of the lowest-order condensed phase oxide in the temperature range of 1373K-1423K is free The total content of elements capable of being equal to or less than the standard free energy of formation of Cr oxides in the temperature range is 0.3% by mass or less.

Description

technical field [0001] The present invention relates to a copper-based powder used for infiltration of an iron-based base material. In detail, it relates to a copper-based powder for infiltration that becomes an infiltration material. The infiltration material composed of the copper-based powder can increase the density of an iron-based base material due to its high infiltration rate, and thus can be manufactured. High-strength and high-toughness iron-based alloy sintered parts, and since the infiltration material does not corrode the surface of the substrate, the surface condition of the substrate after infiltration is good, and since no residue remains after infiltration, Therefore, a residue removal step is not required. Background technique [0002] Since higher strength and higher toughness are always required for mechanical parts, further densification of iron-based alloy sintered parts used as mechanical parts is required. [0003] As a method for increasing the den...

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Problems solved by technology

[0012] However, in the case of the infiltration material of Cu alone, although there are advantages in that the infiltration rate is high and no residue remains, there is a problem that corrosion occurs on the surface of the base material.

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