Infiltration cu-based powder

Abstract

[Problem] To provide infiltration Cu-based powder to be an infiltrant for Fe-based substrates, wherein: the infiltrant comprising the Cu-based powder has a high infiltration rate and allows a Fe-basedsubstrate to have a high density, thereby allowing for production of a sintered product of a Fe-based alloy having high strength and high toughness; the infiltrant does not corrode the substrate surface, and thus the surface state of the substrate after infiltration is good; and no residue remains after infiltration, and thus a residue removing step is not required. [Solution] Provided is infiltration Cu-based powder containing Cu and 1.5-4.0 mass% of Fe or Co, wherein the total contained amount of elements, for which the standard free energy of formation of a lowest condensed phase oxide inthe temperature range of 1373-1423K is less than or equal to the standard free energy of formation of a Cr oxide in said temperature range, is less than or equal to 0.3 mass%.

Description

technical field [0001] The present invention relates to a copper-based powder used for infiltration of an iron-based base material. In detail, it relates to a copper-based powder for infiltration that becomes an infiltration material. The infiltration material composed of the copper-based powder can increase the density of an iron-based base material due to its high infiltration rate, and thus can be manufactured. High-strength and high-toughness iron-based alloy sintered parts, and since the infiltration material does not corrode the surface of the substrate, the surface condition of the substrate after infiltration is good, and since no residue remains after infiltration, Therefore, a residue removal step is not required. Background technique [0002] Since higher strength and higher toughness are always required for mechanical parts, further densification of iron-based alloy sintered parts used as mechanical parts is required. [0003] As a method for increasing the den...

AI Technical Summary

Problems solved by technology

[0012] However, in the case of the infiltration material of Cu alone, although there are advantages in that the infiltration rate is high and no residue remains, there is a problem that corrosion occurs on the surface of the base material.

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