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Cutting method of 166-size silicon chip spliced by using novel silicon chips

A cutting method and a new type of technology, applied in the direction of fine working devices, manufacturing tools, stone processing equipment, etc., can solve the problems of cost generation, achieve the effect of improving utilization rate, improving cutting production efficiency, and reducing processing and production costs

Inactive Publication Date: 2020-07-17
CHANGZHOU SHICHUANG ENERGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, in the silicon wafer photovoltaic industry slicing, the general single-wafer ingot needs to be squared by a squaring machine, and cut into various conventional normal ingot sizes for cutting. Recycling and returning to the furnace to pull the crystal, costs will be incurred in the process of returning the scrap material to the furnace; in order to effectively improve the utilization rate of the single wafer rod scrap, reduce the processing cost of the silicon material, and improve the production efficiency, the prescribing can be used. The edge leather is processed into a new type of silicon block (silicon block specification size: length 166mm, width 83mm, thickness 20mm), which is cut by slicing and sticking sticks into 166 silicon wafers. The invention provides a new type of silicon wafer. The cutting method of 166 silicon wafer size can effectively use the cut edges

Method used

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  • Cutting method of 166-size silicon chip spliced by using novel silicon chips
  • Cutting method of 166-size silicon chip spliced by using novel silicon chips

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A method of cutting silicon wafers with a size of 166 silicon wafers by using a new type of silicon wafer, using a multi-wire cutting machine for slicing, specifically including the following steps:

[0029] Step 1: Clean the sticky board 1 and the new silicon block 2. Select the 166mm sticky board and the new silicon block. The size of the new silicon block is 166mm in length, 83mm in width, and 20mm in thickness. Wipe them clean for later use.

[0030] Step 2: Glue sticks: Assemble the new silicon wafer size silicon blocks into 166 size silicon rods. Bond two new silicon blocks 2 into a bonded silicon block with the same longitudinal section as a complete silicon chip, and bond multiple bonded silicon blocks side by side along the length direction of the silicon rod to form a bonded silicon rod. The bonding and curing time is 3 hours , the room temperature is 23-28°C, the gap between adjacent bonded silicon blocks is controlled to a width of 0.5-1mm, and the sticking ...

Embodiment 2

[0036] A method of cutting silicon wafers with a size of 166 silicon wafers by using a new type of silicon wafer, using a multi-wire cutting machine for slicing, specifically including the following steps:

[0037] Step 1: Clean the sticky board 1 and the new silicon block 2. Select the 166mm sticky board and the new silicon block. The size of the new silicon block is 166mm in length, 83mm in width, and 20mm in thickness. Wipe them clean for later use.

[0038] Step 2: Glue sticks: Assemble the new silicon wafer size silicon blocks into 166 size silicon rods. Bond two new silicon blocks 2 into a bonded silicon block with the same longitudinal section as a complete silicon chip, and bond multiple bonded silicon blocks side by side along the length direction of the silicon rod to form a bonded silicon rod. The bonding and curing time is 3 hours , the room temperature is 23-28°C, the gap between adjacent bonded silicon blocks is controlled at a width of 0.5-1mm, and the sticking ...

Embodiment 3

[0044] A method of cutting silicon wafers with a size of 166 silicon wafers by using a new type of silicon wafer, using a multi-wire cutting machine for slicing, specifically including the following steps:

[0045] Step 1: Clean the sticky board 1 and the new silicon block 2. Select the 166mm sticky board and the new silicon block. The size of the new silicon block is 166mm in length, 83mm in width, and 20mm in thickness. Wipe them clean for later use.

[0046] Step 2: Glue sticks: Assemble the new silicon wafer size silicon blocks into 166 size silicon rods. Bond two new silicon blocks 2 into a bonded silicon block with the same longitudinal section as a complete silicon chip, and bond multiple bonded silicon blocks side by side along the length direction of the silicon rod to form a bonded silicon rod. The bonding and curing time is 3 hours , the room temperature is 23-28°C, the gap between adjacent bonded silicon blocks is controlled to a width of 0.5-1mm, and the sticking ...

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Abstract

The invention relates to a cutting method of a 166-size silicon chip spliced by using novel silicon chips, and belongs to the technical field of crystalline silicon processing, and adopts a multi-linecutting machine for slicing. The cutting method comprises the following steps that cleaning of an adhesive plate and novel silicon blocks, rod sticking, feeding, laying of a cutting wire net, cuttingand discharging, wherein in the step of rod sticking, the novel silicon blocks are bonded into a 166-size silicon rod; in the step of feeding, the bonded silicon rod is installed onto the multi-lineslicer to be cut; in the step of laying of the cutting wire net, a plurality of sub wire nets are arranged on a cutting roller at intervals and correspond to the novel silicon blocks respectively; inthe step of cutting, the multi-line cutting machine adopts wiring reciprocating to cut the silicon rod; and in the step of discharging, the silicon rod is separated from a cutting line. By means of the cutting method, the utilization rate of the edge leather of a single-crystal rod is effectively increased, and the processing and production costs are reduced.

Description

technical field [0001] The invention belongs to the technical field of crystal silicon processing, and in particular relates to a cutting method for assembling 166 silicon wafers by using new silicon wafers. Background technique [0002] At present, in the silicon wafer photovoltaic industry slicing, the general single-wafer ingot needs to be squared by a squaring machine, and cut into various conventional normal ingot sizes for cutting. Recycling and returning to the furnace to pull the crystal, costs will be incurred in the process of returning the scrap material to the furnace; in order to effectively improve the utilization rate of the single wafer rod scrap, reduce the processing cost of the silicon material, and improve the production efficiency, the prescribing can be used. The edge leather is processed into a new type of silicon block (silicon block specification size: length 166mm, width 83mm, thickness 20mm), which is cut by slicing and sticking sticks into 166 sil...

Claims

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Application Information

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IPC IPC(8): B28D5/00B28D5/04
CPCB28D5/00B28D5/0058B28D5/045
Inventor 刘云强邢旭李璐
Owner CHANGZHOU SHICHUANG ENERGY CO LTD