Embedded high-heat-dissipation fan-out type packaging structure and packaging method
A technology of packaging structure and packaging method, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve problems such as deficiencies, achieve good heat dissipation effect, improve heat dissipation environment, and improve heat dissipation effect
Active Publication Date: 2020-07-17
GUANGDONG UNIV OF TECH
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Problems solved by technology
[0004] In order to solve the problem that the existing chip packaging structure still has insufficient heat dissipation capabilities, the present invention provides an embedded high heat dissipation fan-out packaging structure and packaging method, which provides stable support for fan-out packaging of chips , and greatly improves the heat dissipation effect of the package structure
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[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0032] Embodiments of the invention include:
[0033] Such as figure 1 As shown, an embedded high heat dissipation fan-out packaging structure, including chips 3 with bumps, a graphene carrier board with grooves, a plastic sealing layer 10, a fixed layer 4, a solder resist layer 8, and a rewiring Layer 7, dielectric layer 5 and solder ball 9; Dielectric layer 5 is covered on the graphene carrier plate, and then wiring layer 7 is covered on the dielectric layer 5, and the back side of chip 3 is bonded on the graphene...
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The invention relates to an embedded high-heat-dissipation fan-out type packaging structure which comprises a chip with a salient point, a graphene carrier plate with a groove, a plastic packaging layer, a fixing layer, a solder mask layer, a rewiring layer, a dielectric layer and a solder ball. The graphene carrier plate is covered with the dielectric layer, the dielectric layer is covered with the rewiring layer, and the back surface of the chip is bonded in the groove of the graphene carrier plate through the fixing layer. The chip is bonded with the rewiring layer through a lead, the plastic package layer wraps the chip, the solder ball is connected above the rewiring layer, and the solder mask layer is arranged above the rewiring layer. According to the embedded high-heat-dissipationfan-out type packaging structure, the stable support is provided for the fan-out type packaging of the chip, and the heat dissipation effect of the packaging structure is greatly improved.
Description
technical field [0001] The invention relates to the technical field of packaging structures, in particular to an embedded high heat dissipation fan-out packaging structure and a packaging method. Background technique [0002] With the trend of high performance and integration of electronic products, chips are developing in the direction of higher density, faster speed, and lower cost, and power electronic devices are gradually adopting advanced packaging technologies, such as wafer-level packaging or embedded packaging. . Wide bandgap semiconductor power electronic devices have continuously achieved technological breakthroughs in recent years, and have broad market application prospects. This type of device has the advantages of higher efficiency, higher switching frequency and higher operating temperature, and has shown its great potential in the fields of new energy power generation, electric vehicles, charging piles, power conversion and management systems, and industria...
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IPC IPC(8): H01L23/498H01L23/14H01L23/373H01L23/13H01L21/48H01L21/60
CPCH01L23/49822H01L23/49816H01L23/147H01L23/3738H01L23/13H01L21/4857H01L21/4853H01L24/83H01L24/85H01L2224/92247H01L2224/48227H01L2224/73265H01L2924/181H01L2224/32225H01L2924/00012H01L2924/00
Inventor 崔成强杨冠南徐广东张昱
Owner GUANGDONG UNIV OF TECH