Grinding mold and grinding method of quartz wafer
A technology for quartz wafers and grinding methods, which is applied in the direction of grinding devices, grinding machine tools, manufacturing tools, etc., can solve the problems of reduced star wheel strength, increased quartz wafer rejection rate, etc., to increase frequency, improve grinding pass rate, and reduce costs Effect
Pending Publication Date: 2020-07-24
东晶电子金华有限公司
View PDF0 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, since the final thickness of the quartz wafer depends on the thickness of the star wheel, when the quartz wafer is too thin, the strength of the star wheel decreases and cannot stably drive the movement of the quartz wafer, which in turn leads to an increase in the reject rate of the quartz wafer
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0053] In order to understand the above-mentioned purpose, features and advantages of the present invention more clearly, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.
[0054] In the following description, many specific details are set forth in order to fully understand the present invention. However, the present invention can also be implemented in other ways different from those described here. Therefore, the protection scope of the present invention is not limited by the specific details disclosed below. EXAMPLE LIMITATIONS.
[0055] Refer below Figure 1 to Figure 9 A grinding method of the grinding mold and the quartz wafer according to some embodiments of the present invention is described.
[0056] In the embodiment ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention provides a grinding mold and a grinding method of a quartz wafer. The grinding mold is used for grinding the quartz wafer, the grinding mold comprises a first template and a second template; a mounting hole is formed in the first template and is matched with the quartz wafer; the second template comprises a body and a mounting block, the body is attached to the first template, the mounting block is arranged on the body and embedded in the mounting hole; and the height of the mounting block is smaller than the height of the mounting hole. According to the grinding mold, due to thefact that the thickness of the quartz wafer depends on the depth of a mounting groove, the quartz wafers with different thicknesses can be obtained by adjusting the depth of the mounting groove, thethickness of the quartz wafer is not limited by the thickness of the grinding mold any more, the quartz wafer with thinner thickness can be further processed, the frequency of a quartz crystal resonator is improved, and the size of the quartz crystal resonator is reduced.
Description
technical field [0001] The invention relates to the technical field of quartz wafers, in particular to a grinding mold and a grinding method for a quartz wafer. Background technique [0002] At present, with the development of 5G, the frequency of the required quartz crystal resonator is getting higher and higher, and the frequency of the fundamental frequency is also required to be higher and higher, so the thickness of the quartz wafer needs to be thinner and thinner. [0003] In the related art, the processing technology of the quartz wafer is mainly based on grinding. When grinding the quartz wafer, the quartz wafer needs to be placed in a star wheel, and the star wheel drives the quartz wafer to move in the grinding equipment. However, since the final thickness of the quartz wafer depends on the thickness of the star wheel, when the quartz wafer is too thin, the strength of the star wheel decreases and cannot stably drive the movement of the quartz wafer, which in turn ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): B24B37/10B24B37/30B24B37/04
CPCB24B37/042B24B37/10B24B37/30
Inventor 符清铭虞亚军李庆跃骆红莉郭雄伟黄文俊林土全
Owner 东晶电子金华有限公司