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Coc fiber automatic coupling packaging equipment

A technology of automatic coupling and packaging equipment, applied in laser welding equipment, welding equipment, welding equipment, etc., can solve the problems of low coupling accuracy of pigtails, high packaging cost, low product qualification rate, etc., to reduce manual participation degree, short equipment idle time, and the effect of reducing production costs

Active Publication Date: 2021-08-06
CENT SOUTH UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a COC optical fiber automatic coupling and packaging device, the purpose of which is to solve the problems in the prior art that the pigtail coupling accuracy is not high, the packaging cost remains high, and the product qualification rate is low

Method used

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  • Coc fiber automatic coupling packaging equipment
  • Coc fiber automatic coupling packaging equipment
  • Coc fiber automatic coupling packaging equipment

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Embodiment Construction

[0037] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.

[0038] Aiming at the problems in the prior art of low COC optical fiber coupling precision, high packaging cost and low product qualification rate, the invention provides a COC optical fiber automatic coupling packaging device.

[0039] Such as figure 1 , figure 2 , Figure 4 , Figure 10 and Figure 11 As shown, the embodiment of the present invention provides a COC optical fiber automatic coupling packaging device, including: a bottom plate 1, a mounting plate 2, a beam frame 3, a first clamping mechanism 4, a second clamping mechanism 5, and a power-on mechanism 6 , a laser welding mechanism 7 and a monitoring mechanism 8; the mounting plate 2 is mounted on the base plate 1 through bolts, and the bottoms of both ends of the beam frame 3 are insta...

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Abstract

The invention provides a COC optical fiber automatic coupling and packaging device, comprising: a mounting plate is installed on the bottom plate, beams are erected on the bottom plate and located at both ends of the mounting plate; a first clamping mechanism is arranged on one side of the mounting plate, and the first clamping mechanism The mechanism is used to clamp the pigtail, and the end of the pigtail is connected to an optical power meter; the second clamping mechanism is set in the middle of the mounting plate, and the second clamping mechanism is used to clamp the COC base; The clip mechanism is relatively arranged on the other side of the mounting plate; the laser welding mechanism is arranged on the beam frame; the monitoring mechanism is provided with a first monitoring device and a second monitoring device, the first monitoring device is arranged on the beam frame, and the second monitoring device is set The bottom plate is located outside the second clamping mechanism; the invention has reasonable design, accurate detection accuracy and high utilization rate, reduces the degree of manual participation, reduces the efficiency of product damage, and effectively reduces production costs.

Description

technical field [0001] The invention relates to the technical field of butterfly semiconductor laser production devices, in particular to a COC optical fiber automatic coupling and packaging equipment. Background technique [0002] With the development of COC optical fiber communication and COC optical fiber sensing technology, the preparation of optoelectronic devices has become the key to the progress of optical information technology. In optical communication products, the demand for optoelectronic devices such as butterfly semiconductor lasers is increasing with the development. The butterfly semiconductor laser is the most commonly used long-distance transmission optical signal amplification device in the COC optical fiber communication industry. An important component, that is, the COC unit, needs to be installed in the butterfly semiconductor laser. [0003] The COC unit is composed of a base and a pigtail. The base part is pre-installed with a laser chip and a lens....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/21B23K26/08B23K26/70B23K37/04
CPCB23K26/0884B23K37/0443B23K26/21B23K26/702
Inventor 段吉安唐佳卢胜强徐聪彭晋文
Owner CENT SOUTH UNIV