Mask plate and preparation method
A mask and substrate technology, used in semiconductor/solid-state device manufacturing, vacuum evaporation plating, coating, etc., can solve problems such as easy displacement and deformation, avoid position shift, improve production yield, ensure The effect of alignment accuracy
Active Publication Date: 2020-07-31
BOE TECH GRP CO LTD +1
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Problems solved by technology
[0004] The embodiment of the present invention provides a mask plate and a preparation method to solve the problem that the alignment hole of the alignment strip is easily displaced and deformed during the evaporation process
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[0042] In order to make the objectives, technical solutions and advantages of the present invention clearer, the embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that, the embodiments in the present application and the features in the embodiments may be arbitrarily combined with each other if there is no conflict.
[0043] figure 1 is a structure diagram of a mask, figure 2 for figure 1 A schematic diagram of the structure of the alignment of the mask plate and the substrate is shown. like figure 1 As shown, the mask 1 includes a frame (Frame) 10, alignment strips (AlignMask) 11 disposed on both sides of the first surface 10a of the frame 10, a support frame (Full Mask) 12 disposed on the frame 10, and disposed on the The first surface 10a of the frame 10 is overlapped with a fine metal mask (Fine Metal Mask, FMM) 13 on the support frame 12, and the first surface 10a is the surface of th...
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Abstract
The invention discloses a mask plate and a preparation method, and relates to the technical field of display. The mask plate comprises a framework and alignment strips arranged on the framework. The framework comprises two oppositely-arranged first framework sides and two oppositely-arranged second framework sides. The framework is defined by the first framework sides and the second framework sides. Each of the first framework sides and the second framework sides comprises a first surface and a second surface which are arranged oppositely. The first surfaces are arranged to be surfaces opposite to a substrate in the evaporation process. Grooves penetrating through the second framework sides in the extending direction of the first framework sides are formed in the first surfaces of the first framework sides. The alignment strips are arranged in the grooves, and the distance between the surfaces, opposite to the substrate, of the alignment strips and the second surfaces is smaller than or equal to the distance between the first surfaces and the second surfaces. Alignment holes are formed in the alignment strips and are located in the corner positions of the framework. According to the mask plate, the alignment strips are arranged in the grooves, the surfaces, opposite to the substrate, of the alignment strips are not higher than the first surfaces, and the positions of the alignment strips are prevented from offsetting.
Description
technical field [0001] The present invention relates to the field of display technology, and more particularly, to a mask plate and a preparation method. Background technique [0002] Organic Light Emitting Diode (OLED) devices have excellent features such as ultra-thin, self-luminous, organic material, planar structure, low-temperature manufacturing process, and compatibility with plastic substrates, and can be used as display panels. [0003] In the OLED production process, evaporation is the link that most affects its yield. In the current evaporation process, a mask is generally used to control the evaporation pixels. In order to ensure that the mask can have an accurate relative position with the substrate, the usual method is to weld an alignment strip for alignment on the mask, and an alignment hole is made on the alignment bar, and the evaporation machine passes the alignment. The alignment mark on the substrate and the alignment hole on the alignment bar ensure th...
Claims
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IPC IPC(8): C23C14/04C23C14/24H01L51/56
CPCC23C14/042C23C14/24H10K71/166H10K71/00
Inventor 马超郭登俊周俊吉郑安辉伍青峰黄世花张文畅
Owner BOE TECH GRP CO LTD