Membrane electrode packaging structure and packaging method
A packaging structure and packaging method technology, applied in the direction of circuits, fuel cells, electrical components, etc., can solve problems such as high difficulty in quality control, lower production efficiency, and affect performance, so as to save frame materials and adhesive materials, and reduce leakage Possibility of air leakage and the effect of reducing the problem of air leakage
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[0034] The specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0035] Such as Figure 5 , the membrane electrode encapsulation method comprises the following steps:
[0036] ① Using only one frame 1, surface plasma etching or laser etching is performed on the top surface of the frame 1 to construct a depression 2, and the area surrounded by the inner side wall 21 of the depression 2 (such as Figure 6 The area surrounded by dotted lines) is the same shape and size as the catalyst coating film 4, and the thickness value of the inner side wall 21 at the depression 2 is equal to the thickness value of the catalyst coating film 4;
[0037] ② Coating a layer of first adhesive 3 with a thickness of 3 to 20 microns on the bottom wall 22 of the depression 2, and the first adhesive 3 is in contact with the inner side wall 21 of the depression 2;
[0038] ③ Put the catalyst coating film 4 into the area surrounded by...
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