Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Microwave plasma reactor

A microwave plasma and reactor technology, which is applied in the direction of plasma and electrical components, can solve the problems of insufficient energy density and uneven electric field distribution of microwave reactors, and achieve the effect of increasing the electric field intensity and expanding the application field

Active Publication Date: 2020-08-07
BEIJING UNIV OF TECH
View PDF9 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The embodiment of the present invention provides a microwave plasma reactor to solve the problems of uneven electric field distribution and insufficient energy density in existing microwave reactors

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Microwave plasma reactor
  • Microwave plasma reactor
  • Microwave plasma reactor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0038]In the description of the embodiments of the present invention, it should be noted that, unless otherwise specified and limited, the terms "upper", "lower", "left", "right", etc. After the absolute position changes, the relative position relationship may also change accordingly. Those of ordinary skill in the art can understand the spe...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of microwave reaction devices, and discloses a microwave plasma reactor, which comprises a multi-channel microwave transmission reaction body, a self-triggering ignition device and at least one layer of microwave source assembly, wherein a microwave resonant cavity is arranged in the multi-channel microwave transmission reaction body, each layer of microwave source assembly comprises a plurality of microwave transmission excitation sources, the plurality of microwave transmission excitation sources are distributed along the circumferential directionof the multi-channel microwave transmission reaction body, the frequency of the microwave transmission excitation source is equal to the resonant frequency of the working mode in the microwave resonant cavity, the self-triggering ignition device comprises a conical ignition structure arranged at the end of the multi-channel microwave transmission reaction body, the tip of the conical ignition structure faces the interior of the microwave resonant cavity, and an airflow channel is formed in the conical ignition structure and penetrates to the tip of the conical ignition structure. The microwave plasma reactor can effectively enhance the energy density of plasmas and increase the plasma area range in the microwave reactor, and is beneficial to expanding the application field of microwave plasmas.

Description

technical field [0001] The invention relates to the technical field of microwave devices, in particular to a microwave plasma reactor. Background technique [0002] Plasma generation methods include DC discharge, radio frequency discharge, microwave discharge, etc. The disadvantages of DC discharge are electrode discharge, low density, low degree of ionization, and high operating pressure; although the density and degree of ionization of radio frequency discharge have been improved, the scope of application is limited; compared with other technologies, microwave discharge technology has energy A series of advantages such as high conversion efficiency, no electrode pollution and a wide pressure range are being widely used in industrial fields. [0003] The working mode of commonly used microwave reactors in the microwave resonator can be divided into single-mode microwave resonator and multi-mode microwave resonator. Single-mode microwave resonator means that there is only o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05H1/46
CPCH05H1/46H05H1/461
Inventor 王群卫博唐章宏李永卿
Owner BEIJING UNIV OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com