Jig applied to high-pressure flushing of packaged chip

Abstract

The present invention discloses a jig applied to the high-pressure flushing of a packaged chip. The jig comprises a vertical and rectangular positioning frame, openings are formed at the left side andthe right side of the positioning frame, and supporting lugs are formed on the upper end face and the lower end face of the positioning frame. Longitudinal pin shafts are connected to the supportinglugs in an inserted manner, and idler wheels are fixed to the two ends of each pin shaft in an inserted and sleeved manner. A rear clamping plate is fixed to the inner wall of the rear side of the positioning frame, a rectangular positioning groove is formed in the middle of the rear clamping plate, and the two sides of the rear clamping plate extend out of the positioning frame to form a plurality of inclined discharging grooves. A front clamping plate is inserted into the positioning frame at the front side of the rear clamping plate, a plurality of longitudinal guide columns are inserted into the front end face of the positioning frame, and the rear ends of the guide columns are fixed to the front clamping plate. Bolts are connected to the positions, between the guide columns, of the front end face of the positioning frame in a threaded mode, and the tail ends of the bolts are hinged to the rear clamping plate.

Description

technical field [0001] The invention relates to the technical field of chip packaging equipment, in particular to a jig used for high-pressure flushing of packaged chips. Background technique [0002] At present, the chip packaging process includes chip bonding, silver paste curing, lead welding, light inspection, injection molding, laser typing, high temperature curing, despilling, electroplating annealing, rib cutting and molding, etc.; Injection plastic between the leads around the chip; the existing excess flash is removed by cutting, but cutting is easy to damage the leads, so it is proposed to use weak acid to immerse the lead part, soak the flash together, and then rinse with high-pressure water to remove the overflow Material washed away. In the existing flushing process, due to the high pressure of the water jet, it is easy to cause the deformation of the lead part, and when the water jet is small, the overflow on the packaged chip cannot be washed cleanly, so it i...

AI Technical Summary

Problems solved by technology

[0002] At present, the chip packaging process includes chip bonding, silver paste curing, lead welding, light inspection, injection molding, laser typing, high temperature curing, despilling, electroplating annealing, rib cutting and molding, etc.; Injection plastic between the leads around the chip; the existing excess flash is removed by cutting, but cutting is easy to damage the leads, so it is proposed to use weak acid to immerse the lead part, soak the flash together, and then rinse with high-pressure water to remove the overflow Wash away

In the existing flushing process, due to the high pressure of the water jet, it is easy to cause the deformation of the lead part, and when the water jet is small, the overflow on the packaged chip cannot be washed cleanly, so it is necessary to design a fixture to meet the flushing requirements. Does not cause lead flush deformation

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