Wafer performance testing device and method

Abstract

The invention relates to the technical field of semiconductor testing, in particular to a wafer performance testing device and method. The device comprises a probe station module and a test module. The probe station module comprises a mechanical unit and a calibration positioning unit. The probe station module comprises a wafer table to be tested; the mechanical unit transmits a plurality of single wafers to be tested to a wafer table to be tested by adopting different transmission tracks; the calibration positioning unit detects the current position information of each single wafer to be detected when the single wafer to be detected is located on the wafer table to be tested; when the current position information does not accord with preset position information, the position of each single wafer to be detected is adjusted; and the test module is used for carrying out performance testing on each single wafer to be tested according to the test trigger signal when the test trigger signalis received. The device comprises a plurality of feeding and discharging bins, a plurality of chip carriers can be placed in the feeding and discharging bins at the same time for feeding at the sametime, and a plurality of testing stations conduct testing in parallel, so that unnecessary repeated material feeding and discharging work is reduced, and the testing efficiency is improved.

Description

Technical field [0001] The invention relates to the technical field of semiconductor testing, in particular to a wafer performance testing device and method. Background technique [0002] At present, the MEMS (Micro-Electro-Mechanical System) microphone CV (Capacitance Voltage) test equipment currently in use in the industry is generally a two-station manual placement device and a separate wafer mapping (Wafer Mapping) Methods. The tested wafers are manually placed on the wafer table of the testing equipment one by one for testing. Each tested wafer is tested, and the tested wafer needs to be manually taken out and placed in the next tested wafer. This test method cannot be fully automated, wastes manpower and material resources, is slow, and affects productivity. Some test equipment tests a lot (Lot) of tested wafers placed on a carrier at a time. After the test is completed one batch, the carrier is replaced to check the next batch of tested wafers. carry out testing. Repla...

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Problems solved by technology

[0003] The main purpose of the present invention is to provide a wafer performance testing device and

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