Semiconductor device and manufacturing method thereof
A manufacturing method and semiconductor technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems affecting process and device reliability, and achieve the effect of improving reliability and uniformity
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[0043] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0044] In the following description, a lot of specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here, and those skilled in the art can do it without departing from the meaning of the present invention. By analogy, the present invention is therefore not limited to the specific examples disclosed below.
[0045] As described in the background art, refer to figure 1 As shown, the first wafer 10 and the second wafer 20 are bonded through the first dielectric bonding layer 110 and the second dielectric bonding layer 210. After the first wafer 10 and the second wafer 20 are bonded, The first substrate 100 of the fi...
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