Adjustable surface-mounted packaged semiconductor device clamp and test method

Abstract

The invention relates to an adjustable surface-mounted packaged semiconductor device clamp and a test method. The clamp comprises a first PCB substrate, a second PCB substrate, an adjustable connecting assembly, bases, reeds, a base contact pins, contact pins and elastic bands. Microstrip lines are arranged on the first PCB substrate and the second PCB substrate; the first PCB substrate and the second PCB substrate are respectively provided with a base; reeds are arranged on the two bases; the reeds are connected with microstrip lines through base contact pins, and the microstrip lines are connected with the contact pins; the first PCB substrate is connected with the second PCB substrate through the adjustable connecting assembly, and the relative position between the first PCB substrate and the second PCB substrate is changed by adjusting the adjustable connecting assembly, so that the relative position between the two bases is changed; pins on the two sides of a surface-mounted packaged semiconductor device to be tested are in contact with the reeds on the two bases respectively, and the surface-mounted packaged semiconductor device to be tested is bound to the two bases throughthe elastic bands, so that the pins and the reeds are tightly pressed.

Description

technical field [0001] The invention relates to the technical field of semiconductor testing and analysis, in particular to an adjustable surface-mounted semiconductor device fixture and a testing method. Background technique [0002] The development level of semiconductor device testing technology is directly related to its various performance indicators, so it is very important for the overall development of semiconductor devices. With the rapid development of large-scale integrated circuits and the continuous expansion of application fields, not only the integration level of integrated circuits has increased rapidly, the scale and density have also increased rapidly, but also the number of pins of devices has increased. On the other hand, With the continuous improvement of circuit and system integration requirements, the volume requirements of semiconductor devices are becoming more and more stringent, so the packaging forms of semiconductor devices are emerging in an end...

AI Technical Summary

Problems solved by technology

At present, when testing surface-mounted semiconductor devices, it is very expensive to customize a fixture for each surface-mounted semiconductor device.

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