Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Cleaning tank structure on semiconductor silicon wafer cleaning machine

A silicon wafer cleaning and cleaning tank technology, which is used in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of high consumption of pure water and increased consumption of pure water, and achieve the effect of saving water and energy and reducing consumption.

Inactive Publication Date: 2020-08-25
杭州易正科技有限公司
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing specific cleaning method is to place the silicon chip on the material frame carrying the silicon chip, soak the material frame carrying the silicon chip into the liquid medicine tank, then lift the material frame, drain the water, and then put the material frame into pure water Soaking and cleaning in the tank requires the pure water in the pure water tank to clean the liquid medicine adhered to the surface of the material frame at the same time. It takes a lot of pure water to clean the silicon wafer itself. Adding the cleaning material frame will seriously increase the pure water Consumption

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Cleaning tank structure on semiconductor silicon wafer cleaning machine
  • Cleaning tank structure on semiconductor silicon wafer cleaning machine
  • Cleaning tank structure on semiconductor silicon wafer cleaning machine

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0024] Example: see Figures 1 to 6 As shown, a cleaning tank structure on a semiconductor silicon wafer cleaning machine includes a cleaning table 1 on the cleaning machine. A liquid medicine tank 2 and a pure water tank 3 are plugged and fixed on the cleaning table 1. Inserted with a silicon chip carrying bracket 4, the silicon chip supporting bracket 4 includes a rectangular frame 41, the inner wall of the front and rear sides of the upper part of the frame 41 is formed with a number of relative slots 411, the front and rear of the lower part of the frame 41 The inner wall of the side is formed with a slot that is connected with the slot 411 and runs through the lower end surface of the frame body 41. The outer wall of the frame body 41 on both sides of the slot is formed with an inlet and outlet notch 412, and the upper and lower bottom surfaces of the inlet and outlet notch 412 There are several relative positioning grooves 413 formed, and several horizontal support rods ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a cleaning tank structure on a semiconductor silicon wafer cleaning machine. The cleaning tank structure comprises a cleaning table on the cleaning machine; a liquid medicine tank and a pure water tank are inserted and fixed on the cleaning table; silicon wafer bearing supports are inserted into the liquid medicine tank and the pure water tank; and each the silicon wafer bearing support comprises a frame body. A plurality of opposite slots are formed in the inner walls of the front side and the rear side of the upper part of the frame body; cutting grooves are formed inthe inner walls of the front side and the rear side of the lower part of the frame body; inlet and outlet notches are formed in the outer walls of the frame body on two sides of the cutting grooves;a plurality of opposite positioning grooves are formed in the upper bottom face and the lower bottom face of the inlet and outlet notches; supporting rods are inserted into the positioning grooves inthe upper side of the inlet and outlet notches; the right end of each supporting rod extends out of the frame body and is fixed to a connecting strip; an extension rod is fixed to the connecting strip; the upper end of the extension rod is fixedly connected with a piston rod of a supporting air cylinder; the supporting air cylinder is fixed to a supporting support; and the supporting support is fixed to the frame body.

Description

technical field [0001] The invention relates to the technical field of semiconductor cleaning machines, in particular to a structure of a cleaning tank on a semiconductor silicon wafer cleaning machine. Background technique [0002] Integrated circuit chips made of silicon wafers are conventional semiconductor products, and silicon wafers need to be cleaned before making integrated circuit chips. The existing silicon chip cleaning is first put into the chemical solution tank for surface chemical treatment, and then sent into the cleaning tank (using pure water for cleaning, also called pure water tank) to clean up the chemical solution adhered to the surface. The existing specific cleaning method is to place the silicon chip on the material frame carrying the silicon chip, soak the material frame carrying the silicon chip into the liquid medicine tank, then lift the material frame, drain the water, and then put the material frame into pure water Soaking and cleaning in the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/673H01L21/67
CPCH01L21/67057H01L21/67323
Inventor 徐俊
Owner 杭州易正科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products