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Radiator and preparation method thereof

A heat sink, thermoplastic material technology, applied in the field of heat sink and its preparation, can solve the problems of large amount of production, high energy consumption, environmental hazards, etc., and achieve the effects of reducing pollution, low preparation temperature, and reducing energy consumption

Inactive Publication Date: 2020-08-28
GUANGZHOU SHIYUAN ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the preparation process of the existing ceramic radiator, high temperature is used to melt and bond the ceramic particles. The heating temperature in the preparation process is generally greater than 1000°C, and sometimes even exceeds 1800°C. The energy consumption in the production process is high, and the preparation process Will produce a large amount of carbon dioxide gas, causing harm to the environment

Method used

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  • Radiator and preparation method thereof
  • Radiator and preparation method thereof
  • Radiator and preparation method thereof

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preparation example Construction

[0051] The embodiment of the present application also provides a manufacturing method of the heat sink. see figure 1 , the preparation method of the radiator includes the following steps 110 and 120.

[0052] In step 110, 300-500 parts by mass of ceramic particles and 5-15 parts by mass of binder are uniformly mixed, and the material of the binder is a thermoplastic material.

[0053] In one embodiment, the step 110 of uniformly mixing 300-500 parts by mass of ceramic particles and 5-15 parts by mass of binder includes the following process:

[0054] Add 300-500 parts by mass of ceramic particles and 5-15 parts by mass of binder into a high-speed mixer for mixing, the mixing time is 15 seconds to 30 seconds, and the speed of the high-speed mixer is 1000r / min-1500r / min . Mixing can be repeated 3 to 6 times. In an exemplary embodiment, when adding 300-500 parts by mass of ceramic particles and 5-15 parts by mass of binder into a high-speed mixer for mixing, the mixing time c...

Embodiment 1

[0088] First, 500 parts by mass of ceramic particles and 10 parts by mass of a binder were dried in a drying oven at 60° C. for 3 hours. The ceramic particles include aluminum nitride particles with a particle size of 30um and aluminum nitride particles with a particle size of 3um, and the mass ratio of aluminum nitride particles with a particle size of 30um to aluminum nitride particles with a particle size of 3um is 1:1 . The material of the binder is nylon 46, and the particle size of the binder is 2um.

[0089] Subsequently, the ceramic particles and the binder were placed in a high-speed mixer, the mixing time was 15 seconds, the speed of the high-speed mixer was 2500r / min, and the mixing was repeated 4 times to obtain a mixture of the ceramic particles and the binder;

[0090] Subsequently, the obtained mixture is filled into the cavity of the mould, and the mixture is pressurized by the pressure head;

[0091] Subsequently, the mold is heated, and the heating program ...

Embodiment 2

[0095] First, 400 parts by mass of ceramic particles and 8 parts by mass of a binder were dried in a drying oven at 75° C. for 3 hours. The ceramic particles include aluminum nitride particles and aluminum oxide particles, and the mass ratio of the aluminum oxide particles to the aluminum nitride particles is 3:1. The aluminum nitride particles include aluminum nitride particles with a particle size of 50um and alumina particles with a particle size of 4um, and the mass ratio of the aluminum nitride particles with a particle size of 50um to the alumina particles with a particle size of 4um is 1:2. The particle size of alumina particles is 15um. The material of the binder is high-density polyethylene, and the particle size of the binder is 3um.

[0096] Subsequently, the ceramic particles and the binder are placed in a high-speed mixer, the mixing time is 20 seconds, the speed of the high-speed mixer is 2000r / min, and the mixture is repeated 5 times to obtain a mixture of the ...

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Abstract

The invention provides a radiator and a preparation method thereof. The radiator comprises 300 to 500 parts by mass of ceramic particles and 5 to 15 parts by mass of a binder. The binder is made of athermoplastic material. The ceramic particles in the radiator are bonded together through the binder. The preparation method comprises the following steps: uniformly mixing 300-500 parts by mass of ceramic particles with 5-15 parts by mass of the binder, wherein the binder is made of a thermoplastic material; then pressurizing and heating the mixture of the ceramic particles and the binder, so that the binder is melted and enters gaps of the ceramic particles, and thereby the ceramic particles are bonded together after the binder is cured.

Description

technical field [0001] The present application relates to the technical field of radiators, in particular to a radiator and a preparation method thereof. Background technique [0002] Electronic equipment is generally provided with a heat sink to improve the heat dissipation capability of the electronic equipment and prevent the high temperature of the electronic equipment from affecting the performance of the electronic equipment. [0003] The heat sink in the electronic equipment may adopt a ceramic heat sink, and the ceramic heat sink is a heat sink prepared by using a ceramic matrix composite material. However, in the preparation process of the existing ceramic radiator, high temperature is used to melt and bond the ceramic particles. The heating temperature in the preparation process is generally greater than 1000°C, and sometimes even exceeds 1800°C. The energy consumption in the production process is high, and the preparation process A large amount of carbon dioxide ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B26/12C04B26/04C04B26/20B29C67/24H05K7/20
CPCC04B26/122C04B26/045C04B26/04C04B26/20B29C67/248H05K7/2039C04B2201/32C04B2111/00465C04B14/326C04B20/008C04B14/303C04B14/327
Inventor 万虎冯先强
Owner GUANGZHOU SHIYUAN ELECTRONICS CO LTD