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A method for roughening the surface of aluminum nitride ceramic substrate

An aluminum nitride ceramic and substrate surface technology, applied in the field of surface treatment of ceramic substrates, can solve problems such as poor bonding between the substrate and the solder layer, and achieve the effect of solving poor bonding and enhancing bonding

Active Publication Date: 2021-12-17
江苏富乐华半导体科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At present, there is a lack of a roughening method suitable for aluminum nitride ceramic substrates to solve the technical problem of poor bonding between the existing AMB vacuum brazing aluminum nitride ceramic substrates and solder layers

Method used

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  • A method for roughening the surface of aluminum nitride ceramic substrate
  • A method for roughening the surface of aluminum nitride ceramic substrate
  • A method for roughening the surface of aluminum nitride ceramic substrate

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment 1

[0042] Concrete embodiment 1 compares with the test result of comparative example 1:

[0043] 1) Ultrasonic flaw detector test:

[0044] Ultrasonic flaw detectors analyzed the aluminum nitride ceramic substrates in Example 1 and Comparative Example 1 respectively, and the results showed that Example 1 had fewer cracks and voids in the solder bonding layer than Comparative Example 1. see results figure 2 . A2 and B2 are the result diagrams obtained by ultrasonic flaw detector on two randomly selected aluminum nitride ceramic substrates in the manner of specific embodiment 1. A1 and B1 are results obtained by using the method of Comparative Example 1, and two aluminum nitride ceramic substrates randomly selected by an ultrasonic flaw detector.

[0045] 2) Copper porcelain peel strength test:

[0046] Table 1 Surface roughness and copper porcelain peel strength test results

[0047]

[0048] The copper-ceramic peel strength test in specific example 1 and comparative exam...

specific Embodiment 2

[0050] Specific embodiment 2, a method for roughening the surface of an aluminum nitride ceramic substrate, comprising the following steps:

[0051] Step 1, using degreasing agent and pure water to remove oil and impurities on the surface of the aluminum nitride ceramic substrate, and testing the surface roughness of the aluminum nitride ceramic substrate, the initial surface roughness is 0.2-0.25;

[0052] Step 2, immersing the aluminum nitride ceramic substrate treated in step 1 in NaOH solution with a mass fraction of 15%-20%, and ultrasonicating at 50°C for 2-3min;

[0053] Step three, place the aluminum nitride ceramic substrate treated in step two in 1%-3% dilute H 2 SO 4 In the solution, the treatment is 5s-10s, and the temperature is controlled at 15°C-25°C;

[0054] Step 4, wash the aluminum nitride ceramic substrate treated in step 3 with water under pressure at room temperature for 3 minutes;

[0055] Step five, drying the aluminum nitride ceramic substrate treat...

specific Embodiment 3

[0059] Specific embodiment 3, a method for roughening the surface of an aluminum nitride ceramic substrate, comprising the following steps:

[0060] Step 1, remove oil and impurities on the surface of the aluminum nitride ceramic substrate by degreasing agent and pure water, and test the surface roughness of the aluminum nitride ceramic substrate, the initial surface roughness is 0.25-0.3;

[0061] Step 2, immersing the aluminum nitride ceramic substrate treated in step 1 in NaOH solution with a mass fraction of 15%-20%, and ultrasonicating at 50°C for 1-2min;

[0062] Step three, place the aluminum nitride ceramic substrate treated in step two in 1%-3% dilute H 2 SO 4 In the solution, the treatment is 5s-10s, and the temperature is controlled at 15°C-25°C;

[0063] Step 4, wash the aluminum nitride ceramic substrate treated in step 3 with water under pressure at room temperature for 3 minutes;

[0064] Step five, drying the aluminum nitride ceramic substrate treated in ste...

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Abstract

The invention discloses a method for roughening the surface of an aluminum nitride ceramic substrate, comprising the following steps: step 1, removing oil stains and impurities on the surface of the aluminum nitride ceramic substrate by using a degreasing agent and pure water, and testing the surface roughness of the aluminum nitride ceramic substrate degree, according to the test results of surface roughness to determine the degree of subsequent chemical roughening; step two, immerse the aluminum nitride ceramic substrate treated in step one in a NaOH solution of 15%-25% mass fraction; step three, immerse the aluminum nitride ceramic substrate in step one 2. The treated aluminum nitride ceramic substrate is placed in 1%-3% dilute H 2 SO 4 In the solution, process for 5s-10s, and the temperature is controlled at 15°C-25°C; step 4, wash the aluminum nitride ceramic substrate treated in step 3 with water under pressure, at room temperature, for 3 minutes; step 5, wash the aluminum nitride ceramic substrate treated in step 4 Aluminum nitride ceramic substrates are dried. The invention effectively solves the technical problem of poor bonding between the aluminum nitride ceramic substrate and the solder layer in the existing AMB vacuum brazing.

Description

technical field [0001] The invention relates to the technical field of surface treatment of ceramic substrates, in particular to a roughening method of ceramic substrates. Background technique [0002] Aluminum nitride ceramic substrates have been widely used as lining boards for power modules of semiconductor devices because of their low dielectric constant, excellent thermal conductivity, and thermal expansion coefficient matching chips. When active metal brazing (AMB) is used to metallize aluminum nitride ceramic substrates, active metal solder needs to be printed on the surface of aluminum nitride ceramic substrates. [0003] Directly vacuum-sintering the solder bonding layer between the ceramic substrate and copper foil, there is a problem of poor bonding between the AMB vacuum brazing aluminum nitride ceramic substrate and the solder layer. [0004] Chemical roughening is one way to improve coating adhesion. The essence of chemical roughening is to micro-etch the sur...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B41/91
CPCC04B41/91C04B41/5353C04B41/009C04B41/5315C04B35/581
Inventor 王斌贺贤汉孙泉欧阳鹏葛荘周轶靓
Owner 江苏富乐华半导体科技股份有限公司