Fixing assembly of semiconductor chamber and semiconductor chamber
A technology for fixing components and semiconductors. It is used in semiconductor/solid-state device manufacturing, electrical components, discharge tubes, etc. It can solve the problem of black edges of the workpiece to be processed, and achieve the effect of reducing the area.
Active Publication Date: 2020-09-01
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Problems solved by technology
[0005] The invention discloses a fixing component of a semiconductor chamber and a semiconductor chamber to solve the problem that the edge of a workpiece to be processed becomes black during the etching process
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[0025] In order to make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be described clearly and completely with reference to specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
[0026] The technical solutions disclosed in the various embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
[0027] Such as Figure 1 ~ Figure 4 As shown, the embodiment of the present invention discloses a fixing assembly of a semiconductor chamber, which is applied to the semiconductor chambe...
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The invention discloses a fixing assembly of a semiconductor chamber and the semiconductor chamber. The disclosed fixing assembly is used for fixing a to-be-processed workpiece (300), and comprises afirst ring body (100) and a second ring body (200) at least partially located at the inner side of the first ring body (100). The inner edge of the bottom surface of the first ring body (100) is usedfor pressing the to-be-processed workpiece (300), the inner edge of the bottom face of the first ring body (100) is located in the orthographic projection of the second ring body (200) on the bottom face of the first ring body (100), a first gap (410) is formed between the first side face of the second ring body (200) and the inner side face of the first ring body (100), and the first side face isopposite to the inner side face of the first ring body (100). According to the scheme, the problem that the edge of the to-be-processed workpiece becomes black in the etching process can be solved.
Description
Technical field [0001] The invention relates to the technical field of semiconductor chip manufacturing, in particular to a fixed component of a semiconductor cavity and a semiconductor cavity. Background technique [0002] With the rapid development of technology, electronic products such as smart phones and tablet computers have become indispensable products in modern life. These electronic products include many semiconductor chips, and the main manufacturing material of semiconductor chips is wafers. In the process of wafer processing, the circuit pattern needs to be etched, and this process usually uses semiconductor equipment to etch the wafer. [0003] In the related art, a pressure ring is provided in the reaction chamber of a semiconductor device. After the wafer is sent into the reaction chamber as a workpiece to be processed, the pressure ring needs to be used to compress the wafer to prevent the wafer from deviating from the etching during the etching process. position...
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IPC IPC(8): H01J37/20H01J37/305H01J37/32H01L21/67H01L21/687
CPCH01L21/67069H01L21/68721H01L21/67248H01J37/20H01J37/3053H01J37/32724
Inventor 王德志柳朋亮
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD