Method for determining optimal processing direction of single crystal material

A processing direction, single crystal material technology, applied in the direction of analyzing materials, material inspection products, testing semiconductor materials, etc., can solve the problems of material surface quality, processing efficiency, processing force and tool wear, no problem, no processing direction, etc.

Active Publication Date: 2020-09-08
ZHENGZHOU RES INST FOR ABRASIVES & GRINDING CO LTD +1
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  • Abstract
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Problems solved by technology

[0002] Single crystal materials are widely used due to their excellent properties, but due to their anisotropic properties, when the same process parameters are used for grinding, cutting and wire cutting in different directions, the surface quality, processing efficiency, and There are also significant differences in machining forces, or tool wear
[0003] The patent with the application number CN201380047765.4 discloses a Cu-Al-Mn alloy material exhibiting stable superelasticity and its manufacturing method. After manufacturing, it is required that more than 70% of the crystal grains have a crystal orientation deviation angle of 0° ~50°, but it does not propose how to determine the best processing direction
The patent application number is CN201010598282.1 discloses a single crystal material cutting method based on cutting force fluctuation characteristics and a fine-tuning tool holder, which can realize the adjustment of the cutting direction during the single crystal material cutting process, but does not propose which cutting direction is optimal processing direction

Method used

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  • Method for determining optimal processing direction of single crystal material
  • Method for determining optimal processing direction of single crystal material
  • Method for determining optimal processing direction of single crystal material

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Embodiment Construction

[0080] Such as figure 1 As shown, the present invention includes a method for determining the optimal processing direction of a single crystal material, comprising the following steps:

[0081] Step 1: Make a single crystal material sample, determine all potential optimal processing directions of the single crystal material sample; set n potential optimal processing directions for the single crystal material sample;

[0082] Step 2: Process the single crystal material sample along each potential optimal processing direction; set the i-th processing as processing along the i-th potential optimal processing direction;

[0083] Step 3: In the i-th processing, obtain the evaluation features used to evaluate the i-th potential optimal processing direction;

[0084] The evaluation features include processing force during processing, surface topography and subsurface damage layer depth after processing; the processing force includes tangential force and normal force;

[0085] 3.1: ...

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Abstract

The invention discloses a method for determining an optimal processing direction of a single crystal material. The method comprises the following steps: manufacturing a single crystal material sample,determining all potential optimal processing directions of the single crystal material sample, and processing the single crystal material along each potential optimal processing direction; obtainingevaluation characteristics used for evaluating the potential optimal machining direction in each time of machining, wherein the evaluation characteristics comprise the machining force in the machiningprocess and surface topography characteristics and the sub-surface damage layer depth after machining is completed, and the machining force comprises a tangential force and a normal force; selectingthe optimal machining direction according to the evaluation characteristics so as to improve machining efficiency and machining quality.

Description

technical field [0001] The invention relates to the technical field of processing single crystal materials, in particular to a method for determining the optimal processing direction of single crystal materials. Background technique [0002] Single crystal materials are widely used due to their excellent properties, but due to their anisotropic properties, when the same process parameters are used for grinding, cutting and wire cutting in different directions, the surface quality, processing efficiency, and There are also significant differences in machining forces, or tool wear. [0003] The patent with the application number CN201380047765.4 discloses a Cu-Al-Mn alloy material exhibiting stable superelasticity and its manufacturing method. After manufacturing, it is required that more than 70% of the crystal grains <001> have a crystal orientation deviation angle of 0° ~50°, but it does not propose how to determine the optimal processing direction. The patent appli...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N33/00G01N19/00G01B11/24G01B11/30G01B21/20G01B21/18
CPCG01N33/00G01N19/00G01B11/24G01B11/30G01B21/20G01B21/18G01N2033/0095
Inventor 闫宁陆静徐西鹏姜峰王宁昌徐帅赵延军朱建辉
Owner ZHENGZHOU RES INST FOR ABRASIVES & GRINDING CO LTD
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