Patch double pin header and double female header for metal substrate

Abstract

The invention relates to a pin header and a female header structure, particularly to a patch double pin header and a double female header for a metal substrate. The patch pin header is characterized in that a left elbow pin header and a right elbow pin header penetrate through the upper top surface and the lower top surface of an insulating body and are distributed in a bilateral symmetry mode; the elbow portion of the elbow pin header is provided with a patch surface; the patch surface is parallel to the upper top surface or the lower top surface; the patch surface of the left elbow pin header is arranged on the left side of the insulating body; the patch surface of the right elbow pin header is arranged on the right side of the insulating body; and the elbow portion of the elbow pin header is provided with at least two elbows, so that the distance between the patch surface of the elbow portion and the side wall of the insulating body on the corresponding side is greater than a safe distance. The double female header structure can refer to the double pin header. According to the invention, the patch double pin header or double female header is installed in the through holes of themetal substrate, so that automatic welding can be achieved, the working efficiency is improved, the metal substrate and the circuit board are connected in a sleeved mode through the pin header and the female header so as to achieve reliable circuit connection and convenient disassembly and assembly.

Description

technical field [0001] The invention relates to a pin and mother structure, in particular to a patch double pin and double mother used for a metal substrate. Background technique [0002] The metal substrate is a metal circuit board material, which belongs to the general electronic components. It is composed of a thermally conductive insulating layer, a metal plate and a metal foil. It has the characteristics of special magnetic conductivity, excellent heat dissipation, high mechanical strength, and good processing performance. The LED light board usually uses a metal substrate to achieve a good heat dissipation effect. When the LED light board needs to be connected to other circuit boards, since the A side (front) of the LED light board is provided with lamp beads, the circuit connected to the LED light board The board can only be set on the B side (back side) of the LED light board. In order to avoid open circuit, the existing technology is to open through holes on the sur...

AI Technical Summary

Problems solved by technology

LED light boards usually use metal substrates to achieve a good heat dissipation effect. When the LED light board needs to be connected to other circuit boards, since the A side (front) of the LED light board is equipped with lamp beads, the line connected to the LED light board The board can only be installed on the B side (back side) of the LED light board. In order to avoid open circuit, the existing technology is to open a through hole on the surface of the metal substrate, and manually weld multiple mutually insulated wires on the A side of the LED light board as required. The wire passes through the through hole, and the other end of the wire is welded to the circuit board set on the B side (back) of the LED light board. This method consumes man-hours and has low work efficiency. The uncertainty of manual welding leads to poor welding quality. Guaranteed, the connection between the metal substrate and the circuit board circuit on the back is not reliable, which reduces the stability of the circuit

[0003] Board-to-board connection can be realized by using pin header and female socket connection, which has high efficiency and reliable operation. SMD, using reflow soldering, can realize the connection of double-row pins or double-row mothers and circuit boards. The existing SMD double-row pins or double-row mothers have only one bend. If they are installed in the through holes of the metal substrate, see Figure 8 , when opening a through hole on the metal substrate, due to the relatively thin heat conducting insulating layer, the heat conducting insulating layer near the edge of the through hole is susceptible to joint damage, and the substrate material may have burrs protruding when the metal substrate is opened in the through hole. The surface of the pin or double-row female patch extends to the through hole of the metal substrate, and the surface of the patch is close to the circuit board, which is easy to cause the pin header and the edge of the through hole ( Figure 8 area of ​​H) the metal substrate is shorted

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