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Method for manufacturing large solder ball based on electroplating process

An electroplating process and solder ball technology, applied in metal material coating process, circuits, electrical components, etc., can solve the problems of difficult photoresist coating process and too large solder balls.

Inactive Publication Date: 2020-09-22
ZHEJIANG CHENGCHANG TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the process of making solder balls by electroplating, the height of electroplated tin will be affected by the thickness of the photoresist layer. If you want to make larger solder balls, you need to electroplate very thick solder. The current photolithography coating process is generally very slow. Difficult to do
If you increase the plating area, you can increase the amount of tin plating, but it will need to be achieved by increasing the base of the solder balls, and the solder balls still cannot be made too large

Method used

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  • Method for manufacturing large solder ball based on electroplating process
  • Method for manufacturing large solder ball based on electroplating process
  • Method for manufacturing large solder ball based on electroplating process

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Embodiment Construction

[0030] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0031] Such as Figure 1 to Figure 16 As shown, a method for making large solder 104 balls based on an electroplating process specifically includes the following steps:

[0032] 101) Preliminary processing step: making a seed layer 102 on the upper surface of the wafer 101 by physical sputtering, magnetron sputtering or evaporation process, the thickness range of the seed layer 102 is between 1nm and 100um, and its structure is one or more Layer structure, the metal material of each layer adopts one or more mixtures of titanium, copper, aluminum, silver, palladium, gold, thallium, tin, nickel, etc. Coat the photoresist 103 on the seed layer 102, expose the plating area by developing and exposing technology, remove the seed layer 102, and plate the pad; the metal thickness of the pad ranges from 1nm to 100um, and its structure can be one layer ...

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Abstract

The invention discloses a method for manufacturing a large solder ball based on an electroplating process. The method specifically comprises the following steps of 101, primary treatment; 102, secondary treatment; and 103, tin soldering. The method for manufacturing the large solder ball based on the electroplating process is convenient to manufacture and treat.

Description

technical field [0001] The invention relates to the technical field of semiconductors, more specifically, it relates to a method for making large solder balls based on an electroplating process. Background technique [0002] Wafer-level packaging technology is the most widely used technology in the field of advanced packaging, especially for consumer products. Wafer-level packaging is widely used in mobile electronic devices due to its small size, light weight, and thin thickness. on micro-functional devices. [0003] Solder balls or metal bumps are generally used for external soldering and interconnection of wafer-level packaging. The manufacturing process of solder balls includes direct ball planting, solder balls made with solder paste, and solder balls made by electroplating. The bumps include planting metal pillars and electroplating bumps. two kinds. However, in the process of electroplating to make solder balls, the height of electroplated tin will be affected by th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/02C25D5/50C23C14/16C23C14/24C23C14/35C23C14/58H01L21/48
CPCC23C14/16C23C14/165C23C14/24C23C14/35C23C14/5873C25D5/02C25D5/505H01L21/4814
Inventor 王立平
Owner ZHEJIANG CHENGCHANG TECH
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