Manufacturing method of three-dimensional memory and three-dimensional memory manufactured by same
A manufacturing method and memory technology, applied in the direction of electric solid-state devices, semiconductor devices, electrical components, etc., can solve problems such as loss, reduce contact resistance, and affect device stability, and achieve the effect of improving process flow and stabilizing electrical properties
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[0028] Hereinafter, some embodiments of the present disclosure will be described in detail with reference to the accompanying explanatory drawings. When referring to elements of the drawings with reference numerals, although the same elements are shown in different drawings, the same elements will be denoted by the same reference numerals. In addition, in the following description of the present disclosure, in cases where the subject matter of the present disclosure may be unclear, detailed descriptions of known functions and configurations incorporated herein will be omitted.
[0029] The terms used herein are only used for the purpose of describing specific embodiments and are not intended to limit the present disclosure. As used herein, unless the context indicates otherwise, the singular form is intended to also include the plural form. It will also be understood that the terms "including," "including," and "having" used in the specification are intended to specify the exist...
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