Fault injection method based on single event effect

Abstract

The invention discloses a fault injection method based on a single event effect. The method comprises the steps: enabling a test circuit board to be fixed on a three-dimensional moving platform, starting a picosecond pulse laser, setting a laser pulse frequency, and determining the stable operation of the laser; focusing laser to the front surface of a test device, measuring the length a and the width b of the test device, moving the three-dimensional moving platform to enable a laser spot to be located at one corner of microscopic imaging of the test device, and taking the laser spot as a scanning origin; powering up the test device, and recording the working voltage; setting initial laser energy, setting periodic movement of the three-dimensional moving platform, and enabling the laser fluence to cover and scan the test device; when the used lowest laser energy is the lowest, carrying out single event locking on the chip; dismounting the test circuit board, replacing the test device,and repeating the S2-S5 test steps; and closing the picosecond pulse laser, and ending the test. The method has the advantages of being short in test time, low in cost, capable of achieving repeatedreproduction and the like, and cannot be achieved through a fatigue test method. The method is suitable for the technical field of equipment testability verification and evaluation.

Description

technical field [0001] The invention belongs to the technical field of equipment testability verification and evaluation, and in particular relates to a single event effect-based fault injection method. Background technique [0002] Fault injection is an important supporting technology for equipment testability verification and evaluation tests, and it is also a key technology for obtaining potential faults of new equipment. At present, there are two main methods of fault injection in large-scale integrated circuits. The first is to simulate the fault by modifying the firmware program and changing the output signal. The second is to cause the test device to fail through the stress fatigue test, and then cause the fault. In contrast, simulation can only simulate faults in known states. Fault simulation is highly subjective and difficult to represent the objective situation of the newly developed system; fatigue tests are closer to reality and can simulate the future use of th...

AI Technical Summary

Problems solved by technology

At present, there are two main methods of fault injection in large-scale integrated circuits. The first is to simulate the fault by modifying the firmware program and changing the output signal. The second is to cause the test device to fail through the stress fatigue test, thereby causing the fault.

In contrast, simulation can only simulate faults in known states. Fault simulation is highly subjective and difficult to represent the objective situation of the newly developed system; fatigue tests are closer to reality and can simulate the future use of the newly developed system. real fault states that may occur during the process

However, the fatigue test not only takes a long time, but also causes irreversible damage to the element test device, which also increases the test cost

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