Fin type micro-channel design method of a 3D-SIP radio frequency micro-system

Abstract

The invention discloses a fin type micro-channel design method of a 3D-SIP radio frequency micro-system. Firstly, carrying out discretization of a design area; initializing a finite element model according to the actual working condition and the permeability and the thermal conductivity introduced by the Darcy flow; carrying out finite element analysis according to the Darcy flow model and the convective diffusion equation; calculating a target function, a constraint function and sensitivity of the constraint function to design variables by utilizing the obtained physical field information, carrying out ceaseless iteration under MMA algorithm updating until the maximum fluid volume ratio v0 is allowed in the design process, and the maximum inlet and outlet pressure difference delta Plimitis allowed in the design process,or the number of iterations reaches the set maximum number of iterations loopmax. The method does not depend on design experience, can calculate approximate design domain physical field parameters through a finite element method by adopting a Darcy flow model in the design stage, obtains performance parameters of the chip liquid cooling device, improves design reliability, has higher design efficiency and better design result, and meanwhile reduces design cost.

Description

technical field [0001] The invention relates to the technical field of fin-type micro-channel design of a chip liquid cooling device, in particular to a method for designing a fin-type micro-channel of a 3D-SIP radio frequency microsystem. Background technique [0002] The life of the chip is one of the most important factors affecting the service life of electronic products. The heat dissipation of the chip liquid cooling device is an effective way for the chip to dissipate heat. The heating problem of the three-dimensional system package (3D-SIP) chip during use is inevitable, and the development trend of volume reduction and power increase leads to higher and higher heat flux density of the chip heating, while the heating of the 3D-SIP radio frequency microsystem Work will greatly increase the failure rate of the chip and shorten the service life, so higher requirements are put forward for the heat dissipation performance of the chip liquid cooling device. [0003] The f...

AI Technical Summary

Problems solved by technology

The heating problem of the three-dimensional system package (3D-SIP) chip during use is inevitable, and the development trend of volume reduction and power increase leads to higher and higher heat flux density of the chip heating, while the heating of the 3D-SIP radio frequency microsystem Work will greatly increase the failure rate of the chip and shorten the service life, so higher requirements are put forward for the heat dissipation performance of the chip liquid cooling device

This design is inefficient, which hinders the improvement of the performance of the chip liquid cooling device and cannot meet the design requirements

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