Multi-substrate secondary splicing-based long linear array detector splicing structure and implementation method thereof

Abstract

The invention discloses a multi-substrate secondary splicing-based long linear array detector splicing structure and an implementation method thereof. The splicing structure is composed of a linear array infrared detector chip, a Z-shaped detector splicing sub-substrate, a shared large substrate, Z-direction adjusting screws, an X-direction adjusting structure and Y-direction adjusting screws. Inthe installation process, the Z-shaped detector substrates are adjusted to be coplanar through the Z-direction adjusting screws, and then the relative position relation between the Z-shaped detector splicing sub-substrates is adjusted and ensured through the Y-direction adjusting screws and the X-direction adjusting structure. The splicing structure is simple, is convenient to operate, is low in cost, is suitable for the low-temperature packaging occasions of the spliced long linear infrared detectors, and is also suitable for the low-temperature assembling occasions of other multi-low-temperature cold platforms. According to the invention, the Z-shaped detector splicing sub-substrates are engaged end to end for secondary splicing, so that the processing difficulty of the splicing sub-substrates is reduced, the scale expansion of the long linear array detector is facilitated, and the yield of the detectors is improved.

Description

technical field [0001] The invention relates to a low-temperature packaging technology for infrared detectors, in particular to a splicing structure of long-line array detectors based on secondary splicing of multiple substrates and a realization method. It is suitable for low-temperature packaging occasions of spliced ​​linear infrared detectors. It is also applicable to other occasions where multiple low-temperature cold platforms are assembled at low temperature. Background technique [0002] Two important performance indicators of infrared remote sensing instruments are field of view and resolution. In the development of high-resolution large-field optical systems, in order to overcome the contradiction between field of view and resolution, one of the solutions is to use high-resolution, ultra-large-scale infrared focal plane detectors. Infrared detectors are limited by manufacturing process, fill factor, sensitivity, yield, cost and other factors, and their scale is c...

AI Technical Summary

Problems solved by technology

The invention not only realizes the three-dimensional high-precision optical registration of long-line infrared detectors, but also realizes the interchangeability and maintainability requirements of the spliced ​​detectors, and solves the problem of low yield and low room temperature caused by the increase in scale of traditional infrared detectors. Adjustment issues cannot be corrected at low temperatures after splicing

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