Chip defect vertical visual inspection equipment

A visual detection and chip defect technology, applied in measuring devices, conveyor objects, material analysis by optical means, etc., can solve the problems of misjudgment of strip detection, low detection efficiency and detection accuracy of manual detection of chip strips, etc. , to reduce misjudgments, improve gold wire detection efficiency and detection accuracy, and reduce bending deformation

Active Publication Date: 2020-09-29
SHENZHEN GRAND INNOSYS CORP
View PDF11 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the above problems, the purpose of the present invention is to provide a vertical visual detection equipment for chip defects, to solve the detection efficiency and detection accuracy of the current manual detection of chip strips The low rate and the detection of strips are prone to misjudgment due to the influence of gravity during detection

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip defect vertical visual inspection equipment
  • Chip defect vertical visual inspection equipment
  • Chip defect vertical visual inspection equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0042] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0043] to combine Figure 1 to Figure 13 As shown, the chip defect vertical visual detection equipment of the present invention is schematically shown, including a frame 100 and a material box conveying mechanism 200, a material box filling mechanism 300, a material bar conveying mechanism 400, Material strip clamping mechanism 500 and detection mechanism 600. The frame 100 includes a plurality of frames connected to the workbench 120, a touch screen and a warning light are installed on the top of the frame, height-adjustable casters and foot cups are installed on the bottom, and the inclination angle A between the workbench 120 and the horizontal plane is 60°, the detec...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the field of chip detection, and particularly relates to chip defect vertical visual inspection equipment. A feeding device of a material box conveying mechanism conveys a material box to be detected to a material box filling mechanism. A material box clamping jaw of the material box filling mechanism clamps the material box and enables a material strip in the material boxto be aligned with a material strip clamping jaw of the material strip conveying mechanism; the material strip clamping jaw clamps the material strip and enables the material strip to move to a to-be-detected position along the first clamping part and the second clamping part; the first clamping part and the second clamping part clamp the material strip to wait for visual detection of the chip; acamera of the detection mechanism shoots the material strip and detects the gold thread on the material strip through existing computer image recognition software; traditional manual gold thread detection is replaced; the gold thread detection efficiency and the detection accuracy of the chip material strip are improved; and meanwhile, the material strip is located on the detection datum plane inthe visual detection process, the included angle between the detection datum plane and the horizontal plane is 60 to 70 degrees, and bending deformation of the light and thin material strip under theaction of gravity is reduced to the maximum extent.

Description

technical field [0001] The invention relates to the field of chip detection, in particular to a chip defect vertical visual detection device. Background technique [0002] In the production process of the chip material bar, it is necessary to detect the gold wire on the material bar, so as to detect whether there is a manufacturing defect in the material bar in time. The detection of chip gold wires on unmolded material strips mainly involves: gold wire missing detection, gold wire bending detection, redundant gold wire detection, gold wire short circuit detection, gold wire open circuit detection and gold wire surrounding impurities detection, etc. . At present, the detection content of gold wire is mainly completed by human eye observation detection or manual detection combined with electron microscope. Therefore, the manual or semi-manual detection method not only has high labor intensity and low work efficiency, but also the detection accuracy varies from person to per...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & AuthorityApplications(China)
IPC IPC(8): G01N21/956B65G47/90B65G47/52B65G23/04
CPCG01N21/956B65G47/901B65G47/52B65G23/04
Inventor林宜龙丁克详刘飞滕健黄水清王能翔
OwnerSHENZHEN GRAND INNOSYS CORP