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Flexible display and manufacturing method thereof

A flexible display and flexible substrate technology, applied in semiconductor/solid-state device manufacturing, instruments, electric solid-state devices, etc., can solve problems affecting panel reliability, peeling, etc., to facilitate development, reduce risks, and ensure surface roughness performance effect

Active Publication Date: 2021-11-23
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the stress of the inorganic layer will be concentrated at the patterned place, so when the panel is subjected to dynamic bending or reliability testing, these stress-concentrated areas are prone to cracks or peeling, which seriously affects the reliability of the panel.

Method used

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  • Flexible display and manufacturing method thereof
  • Flexible display and manufacturing method thereof
  • Flexible display and manufacturing method thereof

Examples

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Embodiment Construction

[0028] The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the present invention can be practiced. Furthermore, the directional terms mentioned in the present invention are, for example, up, down, top, bottom, front, back, left, right, inside, outside, side, surrounding, central, horizontal, transverse, vertical, longitudinal, axial, The radial direction, the uppermost layer or the lowermost layer, etc. are only directions referring to the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention.

[0029] image 3 It is a schematic cross-sectional view of a flexible display structure according to an embodiment of the present invention. Figure 4A to Figure 4D It is a schematic cross-sectional view of a method for fabricating a flexible display according to an embodiment of the present invention. ...

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PUM

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Abstract

The invention discloses a flexible display and a preparation method thereof. The flexible display includes a flexible substrate, a thin film transistor, a light-emitting layer, a first barrier, a second barrier and an encapsulation layer. The thin film transistor is disposed on the flexible substrate. The light emitting layer is disposed on the thin film transistor. The first barrier and the second barrier are disposed on the thin film transistor, wherein the first barrier is located between the light emitting layer and the second barrier. The encapsulation layer includes a first inorganic layer, an organic layer, and a second inorganic layer, wherein the first inorganic layer covers a part of the first barrier wall, the second barrier wall, and the thin film transistor, and the At least one side of the first inorganic layer close to the second retaining wall has a plurality of first grooves, and the organic layer fills the plurality of first grooves and covers the light emitting layer and the other part of the thin film transistor. A part, and the second inorganic layer cover the first inorganic layer and the organic layer.

Description

technical field [0001] The present invention relates to a display and a preparation method thereof, in particular to a flexible display and a preparation method thereof. Background technique [0002] Organic light-emitting diode (OLED) has the advantages of fast response, wide temperature range, self-illumination, and flexible display. Therefore, OLED is known as the successor to cathode ray tube (cathoderay tube, CRT), liquid crystal The third-generation display technology after liquid crystal display / light-emitting diode (LCD / LED). At present, with the increase of market demand, the R&D and production of flexible OLEDs have become a hot field in the development of the display industry. Among them, thin film packaging technology is the key technology to ensure the reliability of flexible OLED panels. [0003] Generally, the flexible packaging structure is composed of inorganic layer / organic layer / inorganic layer laminated film, wherein the inorganic layer is used to block ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L27/32H01L51/00H01L51/56G09F9/30H10K99/00
CPCG09F9/301H10K59/12H10K77/111H10K50/8428H10K50/84H10K71/00Y02E10/549Y02P70/50
Inventor 黄静
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD