Mainboard repairing method

A motherboard and repair technology, applied in manufacturing tools, electrical solid devices, laser welding equipment, etc., can solve problems such as low alignment accuracy, damage, abnormal pressure, etc., to achieve high repair efficiency, good adaptability, and small thermal impact. Effect
CN111785752AActive Publication Date: 2020-10-16深圳市微组半导体科技有限公司

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
深圳市微组半导体科技有限公司
Publication Date
2020-10-16

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Abstract

The invention relates to a mainboard repairing method. The mainboard repairing method comprises the following steps: S1, acquiring position data of a to-be-repaired device on a mainboard; S2, identifying the mainboard, and obtaining the position of the to-be-repaired device on the mainboard according to the position data; S3, enabling a light hole of a desoldering suction nozzle to adsorb the to-be-repaired device, and enabling a material stirring table of the desoldering suction nozzle to apply an abutting force to the side face of the to-be-repaired device; S4, enabling a laser beam to passthrough the light hole to heat a bonding pad of the to-be-repaired device until the bonding pad is molten, and enabling the desoldering suction nozzle to push the to-be-repaired device to move laterally until the to-be-repaired device is dismounted; S5, enabling the desoldering suction nozzle to suck the normal device to be attached to the desoldering position, and pressing the normal device; S6,enabling the laser beam to pass through the light hole to heat the bonding pad to weld the normal device to the mainboard. When the repair technology is used for repairing damaged lamp beads or Mini IC chips on the Mini LED backlight mainboard to wait for repair devices, the repair efficiency is high, the precision is high, the adaptability to small and micro devices is good, the heat influence issmall, no damage is caused to a repair target, and the high yield of products is ensured.
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Description

technical field

[0001] The invention relates to the field of mainboard processing, and more specifically, relates to a method for repairing a mainboard. Background technique

[0002] As we all know, Mini / Micro LED has excellent performance and is expected to become a new trend of LED display. LCD display using Mini LED backlight technology is superior to current LCD displays in terms of brightness, contrast, color reproduction and energy saving, and can even compete with AMOLED. Control production costs.

[0003] Technological progress drives Mini LED to be upgraded as a small-pitch display product. As an extension of small-pitch technology, Mini LED is expected to usher in application penetration in the field of commercial and home display.

[0004] At present, major domestic display panel manufacturers are actively developing and putting into production lines to produce 65-inch full-panel, 75-inch double-panel and 110-inch miniLED multi-zone backlight displays. Due to t...

Claims

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