A kind of indium tin alloy target and preparation method thereof

An indium tin alloy and target technology, applied in metal rolling, metal rolling, metal processing equipment and other directions, can solve problems such as adverse effects on film properties, and achieve high target blank purity, good sputtering effect, and uniform composition. good effect

Active Publication Date: 2022-08-05
XIANDAO THIN FILM MATERIALS GUANGDONG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method will form an indium-tin-copper alloy during the casting process, and the copper in the backplane will be infiltrated into the target as impurities, which will adversely affect the film performance after sputtering

Method used

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  • A kind of indium tin alloy target and preparation method thereof
  • A kind of indium tin alloy target and preparation method thereof
  • A kind of indium tin alloy target and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] An indium tin alloy target, the specification of which is 1600mm×200mm×10mm, and the preparation method is as follows:

[0035] (1) According to the mass ratio of indium ingot:tin ingot=4:1, put indium ingot and tin ingot with a purity of 4N into a stainless steel crucible with a ratio of opening diameter to height of 0.5, heat and melt at 185°C, and use electromagnetic Stir for more than 5 minutes until the melt composition is uniform;

[0036] (2) Heat the square mold made of stainless steel at 80°C (80-85°C is acceptable), then spray boron nitride release agent on the inner wall of the square mold uniformly, and inject the melt obtained in step (1) into the square mold , demoulding after cooling and forming to obtain an ingot of indium tin alloy with a thickness of 42 mm;

[0037] (3) rolling the indium tin alloy ingot obtained in step (2) with a 150-ton cold and hot reversing rolling mill to a thickness deformation of 20% to obtain an indium tin alloy billet;

[0...

Embodiment 2

[0041]An indium tin alloy target material, its specification is 1600mm×200mm×10mm, and its preparation method is as follows:

[0042] (1) According to the mass ratio of indium ingot:tin ingot=4:1, put indium ingot and tin ingot with a purity of 4N into a stainless steel crucible with a ratio of opening diameter to height of 0.5, heat and melt at 150°C, and use electromagnetic Stir for more than 5 minutes until the melt composition is uniform;

[0043] (2) heating a square mold made of stainless steel at 80°C, then uniformly spraying boron nitride mold release agent on the inner wall of the square mold, injecting the melt obtained in step (1) into the square mold, cooling and forming, and releasing the mold to obtain Ingot of indium-tin alloy with a thickness of 42mm;

[0044] (3) rolling the indium tin alloy ingot obtained in step (2) with a 150-ton hot and cold reversing rolling mill to a thickness deformation of 20% to obtain an indium tin alloy billet;

[0045] (4) Machin...

Embodiment 3

[0048] An indium tin alloy target material, its specification is 1600mm×200mm×10mm, and its preparation method is as follows:

[0049] (1) According to the mass ratio of indium ingot:tin ingot=4:1, put indium ingot and tin ingot with a purity of 4N into a stainless steel crucible with a ratio of opening diameter to height of 0.5, heat and melt at 250°C, and use electromagnetic Stir for more than 5 minutes until the melt composition is uniform;

[0050] (2) heating a square mold made of stainless steel at 80°C, then uniformly spraying boron nitride mold release agent on the inner wall of the square mold, injecting the melt obtained in step (1) into the square mold, cooling and forming, and releasing the mold to obtain Ingot of indium-tin alloy with a thickness of 42mm;

[0051] (3) rolling the indium tin alloy ingot obtained in step (2) with a 150-ton hot and cold reversing rolling mill to a thickness deformation of 20% to obtain an indium tin alloy billet;

[0052] (4) Machi...

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Abstract

The invention discloses a method for preparing an indium-tin alloy target material, which comprises the following steps: putting metal indium and metal tin into a crucible, heating and melting, and stirring until the melt composition is uniform; casting the melt into a shape to obtain an indium-tin alloy cast iron. ingot; rolling the ingot of indium tin alloy to obtain indium tin alloy billet; processing the indium tin alloy billet to a rough target billet thicker than the target size, and processing the binding surface of the rough target billet to be smooth; The plate and the rough target blank are respectively heated and kept at a temperature lower than the critical melting point of the rough target blank, then the two are clamped together and gradually cooled to room temperature. After the binding is qualified, the rough target blank is processed to the target size. The invention can realize the rapid mass production of indium tin targets, there is no melting medium between the target blank and the back plate, the target blank is high in purity, the grain size is uniform and the particle size is small, the average particle size is 100-150 μm, and the composition is uniform. Good, the indium tin composition deviation is less than ±0.5%, and the sputtering effect is good.

Description

technical field [0001] The invention belongs to the technical field of thin film materials, and in particular relates to an indium tin alloy target material and a preparation method thereof. Background technique [0002] With the development of communication technology, 5G communication has begun to be popularized and used. The remarkable feature of 5G signal is that the signal transmission speed is faster, and its transmission speed is 10 to 100 times that of 4G, which greatly facilitates people's lives. [0003] 5G communication uses a spectrum above 3Ghz, and its millimeter-wave wavelength is very short. In order to reduce the attenuation of the signal reception and transmission process, the mobile phone casing is generally made of glass or engineering plastics. However, because consumers prefer metallic luster, for high-end mobile phones, manufacturers will apply magnetron sputtering technology to coat a 1-10 micron film on the mobile phone casing. This can not only giv...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/35C22C13/00B22C3/00C22C28/00B21B1/46B21B37/16
CPCC23C14/3414C22C13/00B22C3/00C22C28/00B21B1/463B21B37/16B21B2261/04
Inventor 黄宇彬梁振耀童培云朱刘
Owner XIANDAO THIN FILM MATERIALS GUANGDONG CO LTD
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